Title:
THIN FILM MATERIAL FOR LOW TEMPERATURE BONDING
Document Type and Number:
WIPO Patent Application WO/2017/160132
Kind Code:
A3
Abstract:
The present invention relates to a thin film material in which at least two kinds of metals are electroplated. In a first heating, melting occurs at a melting point (Tms) of a metal having a low melting point from among the metals, and at the time of a second and subsequent heating after cooling, melting occurs at a melting point (Tma) of an alloy of the metals. The present invention provides a thin film material which is capable of low temperature bonding and has excellent bonding strength.
Inventors:
KIM KYUNG HEUM (KR)
LEE JUN HYEONG (KR)
CHU YONG CHEOL (KR)
JUNG JAE PIL (KR)
LEE JUN HYEONG (KR)
CHU YONG CHEOL (KR)
JUNG JAE PIL (KR)
Application Number:
PCT/KR2017/002966
Publication Date:
September 07, 2018
Filing Date:
March 20, 2017
Export Citation:
Assignee:
DUKSAN HIGH METAL CO LTD (KR)
International Classes:
B23K35/02; B23K1/00; B23K35/26; C22C13/00; H05K3/32; B23K101/36
Foreign References:
| KR20160024827A | 2016-03-07 | |||
| KR20120039698A | 2012-04-25 | |||
| KR20070077613A | 2007-07-27 | |||
| KR100797161B1 | 2008-01-23 | |||
| JP2001246493A | 2001-09-11 |
Attorney, Agent or Firm:
TW INTERNATIONAL PATENT AND LAWFIRM (KR)
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