Title:
THIN-FILM PACKAGING STRUCTURE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/180103
Kind Code:
A1
Abstract:
A thin-film packaging structure comprises a flexible thin film (100) used for covering a device. The flexible thin film comprises at least two organic film layers (1) and at least one inorganic film layer (2). The at least two organic film layers comprise a first organic film layer and a second organic film layer. An inorganic film layer is disposed between the first organic film layer and the second organic film layer. The first organic film layer is in contact with the device. The second organic film layer is disposed on the outermost layer of the flexible thin film. The thin-film packaging structure can effectively block water and oxygen from permeating into the device, thereby satisfying packaging performance of the device.
Inventors:
YANG JIUXIA (CN)
BAI FENG (CN)
WANG YINGZI (CN)
BAI FENG (CN)
WANG YINGZI (CN)
Application Number:
PCT/CN2016/078538
Publication Date:
November 17, 2016
Filing Date:
April 06, 2016
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE OPTOELECTRONICS TECH CO LTD (CN)
BEIJING BOE OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
H01L51/52; H01L27/32; H01L51/56
Foreign References:
| CN103855185A | 2014-06-11 | |||
| CN104882565A | 2015-09-02 | |||
| CN103258955A | 2013-08-21 |
Attorney, Agent or Firm:
ZHONGZI LAW OFFICE (CN)
北京市中咨律师事务所 (CN)
北京市中咨律师事务所 (CN)
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