THIN FILM STRUCTURAL BODY AND METHOD FOR MANUFACTURING THE SAME

WIPO Patent Application WO/2010/032530

A1

Characteristic deterioration, peeling and handleability of a thin film structural body are improved by holding a tensile force applied to a long substrate at a correct value in manufacture of the thin film structural body wherein a thin film is formed on the substrate. Provided is a method for manufacturing a thin film structural body, wherein a thin film having rigidity higher than that of a long substrate (2) is formed on the substrate (2).  The substrate (2) is held by applying a tensile force in a range of substantially 3 MPa or less, and in thin film formation, the thin film is formed while pressing a heater (6), i.e., a heating means, to a portion where the film is to be formed on the substrate (2).

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WADA TAKEHITO (JP)
MATSUYAMA HIDEAKI (JP)

PCT/JP2009/061816

March 25, 2010

June 29, 2009

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FUJI ELECTRIC ADVANCED TECHNOL (JP)
WADA TAKEHITO (JP)
MATSUYAMA HIDEAKI (JP)

C23C16/54; B32B27/06; C23C14/14; C23C14/20; C23C14/56; C23C16/24; C23C16/46; C23C16/509; H01L31/04

JP2002371357A	2002-12-26
JP2004068126A	2004-03-04
JP2001223375A	2001-08-17

OKUYAMA, Shoichi et al. (JP)
Okuyama In addition, it is 1. (JP)

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