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Title:
THIN-FILM STRUCTURAL BODY FOR SUPPRESSING MOVEMENT OF HEAT, AND STRUCTURE AND SUBSTRATE IN WHICH THIN-FILM STRUCTURAL BODY IS LAMINATED
Document Type and Number:
WIPO Patent Application WO/2017/200090
Kind Code:
A1
Abstract:
Provided is a thin-film structural body with which it is possible to suppress movement of heat from the obverse surface to the reverse surface. The thin-film structural body includes a solidified base and hollow microparticles including a metal oxide. The hollow microparticles are densely distributed in the base from one of the surfaces to at least a first position in the depth direction. When the surface of the thin-film structural body is irradiated with heat energy, far-infrared radiation is emitted from the thin-film structural body. The deepest position from which the far-infrared radiation is emitted is at a second position, which is at a lesser distance from the surface than the distance from the surface to the first position.

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Inventors:
ISHIKO TATSUJIRO (JP)
ODA TAKASHI (JP)
KUNISHIMA TAKESHI (JP)
TAZAWA MASATO (JP)
Application Number:
PCT/JP2017/018848
Publication Date:
November 23, 2017
Filing Date:
May 19, 2017
Export Citation:
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Assignee:
NISSIN SANGYO CO LTD (JP)
GREEN ARM CO LTD (JP)
AIST (JP)
International Classes:
B32B27/18; C08J5/18; C09D5/00; C09D7/12; C09D201/00
Domestic Patent References:
WO2002083326A12002-10-24
Foreign References:
JP2006026976A2006-02-02
JP2006150059A2006-06-15
JP2009079221A2009-04-16
JP2002105385A2002-04-10
JP2016216643A2016-12-22
Attorney, Agent or Firm:
PSD (JP)
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