Title:
THIN PLATE BONDING METHOD AND THIN PLATE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2015/194861
Kind Code:
A1
Abstract:
The present invention relates to a thin plate bonding method or a thin plate assembly and, particularly, a thin plate bonding method performs diffusion bonding after increasing surface roughness and coating with a coating material, or after coating with a coating material to increase surface roughness, such that a thin plate assembly has excellent bonding strength even when the diffusion bonding is performed at a low temperature and low pressure, prevents thin plate deformation by thermal stress, and has high air tightness since the coating material fills fine air pores.
Inventors:
PARK JONG-SOO (KR)
HWANG KYUNG-RAN (KR)
LEE DONG-WOOK (KR)
PAKR JU-SEOK (KR)
LEE CHUN-BOO (KR)
LEE SUNG-WOOK (KR)
OH DUCK-KYU (KR)
PAKR JIN-WOO (KR)
JIN MIN-HO (KR)
HWANG KYUNG-RAN (KR)
LEE DONG-WOOK (KR)
PAKR JU-SEOK (KR)
LEE CHUN-BOO (KR)
LEE SUNG-WOOK (KR)
OH DUCK-KYU (KR)
PAKR JIN-WOO (KR)
JIN MIN-HO (KR)
Application Number:
PCT/KR2015/006146
Publication Date:
December 23, 2015
Filing Date:
June 17, 2015
Export Citation:
Assignee:
KOREA ENERGY RESEARCH INST (KR)
International Classes:
B23K20/00; B24C1/10
Foreign References:
| JP2006334638A | 2006-12-14 | |||
| KR920010232B1 | 1992-11-21 | |||
| KR20080108171A | 2008-12-12 | |||
| JP2010094683A | 2010-04-30 | |||
| KR20010075630A | 2001-08-09 |
Attorney, Agent or Firm:
HWANG, E-Nam (KR)
황이남 (KR)
황이남 (KR)
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