Title:
THIN-PLATE HOLDING JIG
Document Type and Number:
WIPO Patent Application WO/2016/006058
Kind Code:
A1
Abstract:
Provided is a holding jig (1) for holding a thin plate, including: a carrier (10); a plurality of spacers (11) that are formed on a surface of the carrier; an adhesive film (13) that adheres at least to the periphery of the carrier so as to cover the surfaces of the plurality of spacers and that has a film base material (13B), a first adhesive layer (131) that is located on an opposite side of the film base material from the carrier and on which a thin plate (20) is placed, and a second adhesive layer (132) that is located on the side of the film base material closer to the carrier; and bonding parts (14) that make the second adhesive layer adhere to the surface of the carrier in regions where the spacers are not formed and that have a smaller thickness than the height of the spacers, wherein the second adhesive layer has a lower adherence than the first adhesive layer so as to be separated from the spacers when the thin plate placed thereon is peeled off from the first adhesive layer.
Inventors:
OHDE SACHIKO (JP)
TANAKA KIYOFUMI (JP)
TANAKA KIYOFUMI (JP)
Application Number:
PCT/JP2014/068318
Publication Date:
January 14, 2016
Filing Date:
July 09, 2014
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
H01L21/683; B32B27/00; C09J7/20; C09J11/04; C09J183/04
Foreign References:
| JP2012256666A | 2012-12-27 | |||
| JP2012209522A | 2012-10-25 | |||
| JP2011222828A | 2011-11-04 | |||
| JP2007250790A | 2007-09-27 |
Attorney, Agent or Firm:
SAKAMOTO TOMOHIRO (JP)
Tomohiro Sakamoto (JP)
Tomohiro Sakamoto (JP)
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