Title:
THIN SHEET-LIKE CONNECTING MEMBER AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/177006
Kind Code:
A1
Abstract:
This manufacturing method for a thin sheet-like connecting member (8) comprises: a step in which a paste that contains first particles (1) containing a first metal, second particles (2) containing a second metal that has a lower melting point than the first metal, and a solvent is applied to a surface of a substrate (3) formed from a material that does not react with the second metal; a step in which the thin sheet-like connecting member (8) is formed on the surface of the substrate (3) by heating the paste to a temperature that is lower than the melting point of the first metal and higher than the melting point of the second metal; and a step in which the thin sheet-like connecting member (8) is obtained by peeling the thin sheet-like connecting member (8) away from the substrate (3).
Inventors:
OTANI ISSEI (JP)
TATSUMI HIROAKI (JP)
SAWADA JUMPEI (JP)
TATSUMI HIROAKI (JP)
SAWADA JUMPEI (JP)
Application Number:
PCT/JP2021/005430
Publication Date:
September 10, 2021
Filing Date:
February 15, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B22F1/00; B22F1/18; B22F7/08; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
| WO2008026761A1 | 2008-03-06 |
Foreign References:
| JP2002301588A | 2002-10-15 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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