Title:
THIN TYPE HEAT UNIFORMIZING PLATE FORMED BY STAMPING PROCESS
Document Type and Number:
WIPO Patent Application WO/2019/056506
Kind Code:
A1
Abstract:
Disclosed in the embodiment of the present application is a heat uniformizing plate. A support structure having a supporting function inside the heat uniformizing plate comprises a plurality of first support bosses spaced from each other on an inner surface of a first cover plate. The first support bosses can be formed by using a universal processing technique, for example, a stamping process, and the processing cost of the universal processing technique is lower than that of an etching process; therefore, compared with the prior art, the heat uniformizing plate reduces the processing cost. And according to the heat uniformizing plate, a vapor chamber of a working medium is automatically formed in a spacing area between two adjacent first support bosses in a process of combining the first cover plate, a second cover plate and a capillary layer, eliminating a need for forming the vapor chamber of the working medium independently by means of a processing technique; thus, according to the heat uniformizing plate of the embodiment of the present application, the processing cost of the heat uniformizing plate is reduced.
Inventors:
ZHANG JUN (CN)
LI WEI (CN)
ZOU LIUJUN (CN)
ZHANG ZHIGUO (CN)
LI WEI (CN)
ZOU LIUJUN (CN)
ZHANG ZHIGUO (CN)
Application Number:
PCT/CN2017/108935
Publication Date:
March 28, 2019
Filing Date:
November 01, 2017
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
F28D15/04; H05K7/20
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Attorney, Agent or Firm:
SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)
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