Title:
THINNED PLATE MEMBER PRODUCTION METHOD AND THINNED PLATE MEMBER PRODUCTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/044588
Kind Code:
A1
Abstract:
This thinned plate member production method is characterized by comprising a laser irradiation step for irradiating a plate member (WF) with a laser beam (LB), and a division step for forming at least a first thinned plate member and a second thinned plate member by dividing the plate member (WF) along a division plane (DP), wherein: in the step for irradiating the plate member (WF) with the laser beam, a plurality of modified portions are formed along the division plane (DP) in the plate member (WF); and the thickness of the first thinned plate member is less than the thickness of the plate member (WF), and the thickness of the second thinned plate member is less than the thickness of the plate member (WF).
Inventors:
IZUMI NAOFUMI (JP)
YAMASHITA SHIGEYUKI (JP)
YAMASHITA SHIGEYUKI (JP)
Application Number:
PCT/JP2018/030804
Publication Date:
March 07, 2019
Filing Date:
August 21, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; B23K26/53
Domestic Patent References:
| WO2016083610A2 | 2016-06-02 |
Foreign References:
| JP2016225536A | 2016-12-28 | |||
| JP2017022283A | 2017-01-26 | |||
| JP2016015447A | 2016-01-28 | |||
| JP2017092314A | 2017-05-25 | |||
| JP2016201575A | 2016-12-01 | |||
| JP2017024039A | 2017-02-02 | |||
| JP2008129596A | 2008-06-05 | |||
| JP2016043401A | 2016-04-04 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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