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Patent Searching and Data


Title:
THINNING MACHINE
Document Type and Number:
WIPO Patent Application WO/2019/127910
Kind Code:
A1
Abstract:
A thinning machine (100), comprising: a body (10), the body being provided with two feeding and grinding shafts (11); a rotary tray (20), the rotary tray being rotationally disposed on the body and located below the feeding and grinding shafts; a plurality of wafer chuck systems (30), each wafer chuck system being used for sucking wafers by means of vacuum, the multiple wafer chuck systems being separately disposed on the rotary tray and driven by the rotary tray so that the stations of the wafer chuck systems are switched, the multiple wafer chuck systems being arranged at intervals, and when the rotary tray rotates to any working position, two of the multiple wafer chuck systems corresponding to the positions of the two feeding and grinding shafts; and a drive member (40), the drive member is connected to the rotary tray so as to drive the rotary tray to rotate. According to the thinning machine, the production efficiency of wafer grinding can be effectively improved, and energy consumption is reduced.

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Inventors:
YANG, Shengrong (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
HE, Dongge (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
YAO, Lixin (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
WANG, Zhongkang (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
YI, Zhongbo (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
LIU, Yuguang (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
ZHANG, Pan (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
Application Number:
CN2018/078721
Publication Date:
July 04, 2019
Filing Date:
March 12, 2018
Export Citation:
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Assignee:
CETC BEIJING ELECTRONIC EQUIPMENT CO., LTD. (No. 1, Taihe 3rd StreetEconomy and Technology Development Zone, Beijing 6, 100176, CN)
International Classes:
B24B7/22; B24B41/06
Foreign References:
EP1170088A22002-01-09
CN105415146A2016-03-23
CN206084668U2017-04-12
CN105514015A2016-04-20
CN105538147A2016-05-04
US8480456B12013-07-09
JP2009111238A2009-05-21
US8647172B22014-02-11
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (10F Bldg. 2, Maples International CenterNo. 32 Xizhimen North Street, Haidian District, Beijing 2, 100082, CN)
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