Title:
THINNING AND POLISHING DEVICE FOR WAFER
Document Type and Number:
WIPO Patent Application WO/2019/007006
Kind Code:
A1
Abstract:
Disclosed is a thinning and polishing device for a wafer, the device comprising: a base (10); a carrying table (20) for placing the wafer thereon, the carrying table (20) being arranged on the base (10) and being movable between a carrying station, a thinning station and a polishing station, and the wafer being able to be placed on the carrying table (20) when the carrying table (20) is in the carrying station; a thinning assembly (30), the thinning assembly (30) being movably arranged on the base (10) so as to carry out a thinning treatment on the wafer located on the carrying table (20) when the carrying table (20) is in the thinning station; and a polishing assembly(40), the polishing assembly(40) being movably arranged on the base (10) so as to carry out a polishing treatment on the wafer located on the carrying table (20) when the carrying table (20) is in the polishing station.
Inventors:
LIANG JIN (CN)
YAO LIXIN (CN)
YANG SHENGRONG (CN)
WANG ZHONGKANG (CN)
YI ZHONGBO (CN)
LIU YUGUANG (CN)
ZHAO SUIHUA (CN)
YAO LIXIN (CN)
YANG SHENGRONG (CN)
WANG ZHONGKANG (CN)
YI ZHONGBO (CN)
LIU YUGUANG (CN)
ZHAO SUIHUA (CN)
Application Number:
PCT/CN2017/118990
Publication Date:
January 10, 2019
Filing Date:
December 27, 2017
Export Citation:
Assignee:
CETC BEIJING ELECTRONIC EQUIPMENT CO LTD (CN)
International Classes:
B24B25/00
Foreign References:
| CN107263267A | 2017-10-20 | |||
| JP2004050345A | 2004-02-19 | |||
| CN103624673A | 2014-03-12 | |||
| JP2003086549A | 2003-03-20 | |||
| US7238087B1 | 2007-07-03 |
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
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