Title:
THIOL COMPOUND AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/218862
Kind Code:
A1
Abstract:
The present invention provides a novel thiol compound and uses thereof. Specifically, the present invention provides: a novel thiol compound; a curing agent containing said thiol compound; a resin composition containing this curing agent and an epoxy compound; a resin composition containing this curing agent and an ene compound having a carbon-carbon double bond in the molecule; and adhesives and sealants that contain these resin compositions. The present invention relates to, inter alia, a dimer of the thiol compound given by formula (II), a resin curing agent that contains this dimer, a resin composition comprising this curing agent and an epoxy compound, and uses of said resin composition.
Inventors:
SHIOIRI RYOSUKE (JP)
AOKI KAZUNORI (JP)
KUMANO TAKESHI (JP)
AOKI KAZUNORI (JP)
KUMANO TAKESHI (JP)
Application Number:
PCT/JP2023/015267
Publication Date:
November 16, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
SHIKOKU CHEM (JP)
International Classes:
C07C323/12; C08G59/66; C08G75/045; C09J163/00; C09K3/10
Domestic Patent References:
| WO2016035565A1 | 2016-03-10 | |||
| WO2016052069A1 | 2016-04-07 |
Foreign References:
| JP2019123824A | 2019-07-25 | |||
| JP2019085408A | 2019-06-06 | |||
| JP2021113304A | 2021-08-05 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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