THIOL-MODIFIED POLYMER, AND COMPOSITION CONTAINING SAID POLYMER AND USE THEREOF

WIPO Patent Application WO/2018/150764

A1

The present invention addresses the problem of providing a composition having excellent adhesion to a base material (e.g., a plastic) and good compatibility with a reactive resin composition. The present invention relates to a composition characterized by containing a thiol-modified polymer that is produced by modifying a polymer with a thiol compound, wherein the polymer is a polymer produced by polymerizing a compound represented by general formula [I]. (In the formula, R1s independently represent a [-CH2-CR3=CHR2] group, a glycidyl group, an alkyl group having 1 to 5 carbon atoms or a hydrogen atom, wherein the R1s may be different from or the same as one another, and at least one of the R1s represents a [-CH2-CR3=CHR2] group; and R2 and R3 in the [-CH2-CR3=CHR2] group independently represent H or CH3.)

JPH0625218	INDUSTRIAL APPLICABILITY [Title of Invention] Method for producing acrylamide sulfonate copolymer
JP2009120756	METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE-BASED POLYMER, MODIFIED CONJUGATED DIENE-BASED POLYMER, AND RUBBER COMPOSITION
JPS58129003	MANUFACTURE OF THERMOPLASTIC CONTAINING BONDAGE STABILIZER

UENISHI AKIHO (JP)
UMAKOSHI HIDEAKI (JP)
IWASA NARUHITO (JP)

PCT/JP2018/000306

August 23, 2018

January 10, 2018

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OSAKA SODA CO LTD (JP)

C08F8/34; C08F2/48; C08F26/06; C08L39/04; C09D11/101; C09D11/106; C09D139/04

JP2016186017A	2016-10-27
JP2013181145A	2013-09-12
JPS5674245A	1981-06-19
JP2015118313A	2015-06-25
JP2013174888A	2013-09-05

YASUTOMI & ASSOCIATES (JP)

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