Title:
THREE-DIMENSIONAL BONDED FILAMENT MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/074075
Kind Code:
A1
Abstract:
A three-dimensional bonded filament material in which multiple filaments are three-dimensionally fusion-bonded to each other, wherein a honeycomb loop structure layer is formed in a region that comprises the center in the thickness direction. As a result, it is possible to provide a three-dimensional bonded filament material in which the filament bonding at the center in the thickness direction is not susceptible to severing even when a local load, etc. is applied.
Inventors:
MIZUNO AKIRA (JP)
KOJIMA MASAKAZU (JP)
KOJIMA MASAKAZU (JP)
Application Number:
PCT/JP2017/031231
Publication Date:
April 26, 2018
Filing Date:
August 30, 2017
Export Citation:
Assignee:
AIRWEAVE INC (JP)
International Classes:
D04H3/14; D04H3/07; D04H3/16
Domestic Patent References:
| WO2017168771A1 | 2017-10-05 | |||
| WO2001068967A1 | 2001-09-20 |
Foreign References:
| JPH09189022A | 1997-07-22 | |||
| JPH0732517A | 1995-02-03 | |||
| US3852152A | 1974-12-03 | |||
| JPS5531222B1 | 1980-08-16 |
Attorney, Agent or Firm:
YAMAMOTO Hideo (JP)
Download PDF: