Title:
THREE-DIMENSIONAL CIRCUIT COMPONENT AND MANUFACTURING METHOD OF THREE-DIMENSIONAL CIRCUIT COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/255496
Kind Code:
A1
Abstract:
Provided is a circuit component having high heat dissipation. This three-dimensional circuit component has a metal member, a first resin layer formed on the metal layer, a first circuit wiring that includes a plating layer and is formed in a wiring region of the surface of the first resin layer, and a first mounted component that is mounted in a mounting region of the surface of the first resin layer and is electrically connected to the first circuit wiring. In the surface of the first resin layer, a surface roughness Rz of an overlap region where the wiring region and the mounting region overlap is 10-120 μm, and a minimum distance between the first circuit wiring in the overlap region and the surface of the first resin layer opposite from the metal member is 10-100 μm.
Inventors:
KITO AKIKO (JP)
YUSA ATSUSHI (JP)
YAMAMOTO SATOSHI (JP)
OTA HIRONORI (JP)
YUSA ATSUSHI (JP)
YAMAMOTO SATOSHI (JP)
OTA HIRONORI (JP)
Application Number:
PCT/JP2022/022757
Publication Date:
December 08, 2022
Filing Date:
June 06, 2022
Export Citation:
Assignee:
MAXELL LTD (JP)
International Classes:
H01L23/12; H01L23/36; H05K1/02; H05K3/44
Foreign References:
| JP2020025123A | 2020-02-13 | |||
| JP2012094605A | 2012-05-17 | |||
| JP2020102587A | 2020-07-02 |
Attorney, Agent or Firm:
UEBA, Hidetoshi et al. (JP)
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