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Patent Searching and Data


Title:
THREE-DIMENSIONAL LAMINATION DEVICE AND THREE-DIMENSIONAL LAMINATION METHOD
Document Type and Number:
WIPO Patent Application WO/2015/151864
Kind Code:
A1
Abstract:
Provided are: a three-dimensional lamination device which manufactures three-dimensional objects with high accuracy; and a three-dimensional lamination method. The three-dimensional lamination device, which forms three-dimensional shapes by laminating moulded layers to a base part, has: a powder supply part which supplies a powder material; a light irradiation part which irradiates the powder material with a light beam and forms the moulded layers by sintering or by melting and solidifying at least one portion of the powder material irradiated by the light beam; a heating part which selectively heats the base part, a region of the moulded layers in which the light beam has passed through a position to be irradiated, or a region in which the light beam has yet to pass through the position to be radiated; and a control device which controls the operations of the powder supply part, the light irradiation part, and the heating part.

Inventors:
YOSHIMURA HITOSHI (JP)
Application Number:
PCT/JP2015/058496
Publication Date:
October 08, 2015
Filing Date:
March 20, 2015
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C67/00; B22F3/105; B23K26/00; B23K26/064; B23K26/082; B23K26/144; B33Y30/00
Foreign References:
JPH11333584A1999-12-07
JP2007222869A2007-09-06
JP2007301980A2007-11-22
JPH0332481A1991-02-13
JP2007286481A2007-11-01
JP2004253783A2004-09-09
JP2008183614A2008-08-14
JP2003019589A2003-01-21
JP2010207874A2010-09-24
JP2009274136A2009-11-26
Other References:
See also references of EP 3127685A4
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
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