Title:
THREE-DIMENSIONAL LED SUBSTRATE AND LED LIGHTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/129415
Kind Code:
A1
Abstract:
A three-dimensional LED substrate comprising: at least one LED element; a silicon substrate on which the LED element is mounted through a microbump and which has, formed therein, a wiring line that is connected to the microbump; a heat-insulating organic substrate which is bound to a surface of the silicon substrate which is opposed to the surface having the LED element mounted thereon, and which has a through-hole through which the wiring line is passed; a chip-mounting substrate which is bound to a surface of the heat-insulating organic substrate which is opposed to the silicon substrate side surface, and which has, formed therein, a wiring line that is connected to the wiring line placed in the through-hole in the heat-insulating organic substrate; and an LED control circuit chip which is connected to the wiring line in the chip-mounting substrate through the microbump, and which is mounted on a surface of the chip-mounting substrate which is opposed to the heat-insulating organic substrate side surface through the microbump.
Inventors:
TOHYAMA NAOYA (JP)
INOUE TAKUYA (JP)
KUMAGAI KOUICHI (JP)
KUNIEDA TAKAHA (JP)
INOUE TAKUYA (JP)
KUMAGAI KOUICHI (JP)
KUNIEDA TAKAHA (JP)
Application Number:
JP2011/059311
Publication Date:
October 20, 2011
Filing Date:
April 14, 2011
Export Citation:
Assignee:
LIQUID DESIGN SYSTEMS INC (JP)
TOHYAMA NAOYA (JP)
INOUE TAKUYA (JP)
KUMAGAI KOUICHI (JP)
KUNIEDA TAKAHA (JP)
TOHYAMA NAOYA (JP)
INOUE TAKUYA (JP)
KUMAGAI KOUICHI (JP)
KUNIEDA TAKAHA (JP)
International Classes:
H01L33/64; F21S2/00; F21V29/15; F21Y101/02
Foreign References:
| JP2006313717A | 2006-11-16 | |||
| JPH06314863A | 1994-11-08 | |||
| JPH0548073A | 1993-02-26 |
Attorney, Agent or Firm:
YAMAMOTO, TAKAO (JP)
Takao Yamamoto (JP)
Takao Yamamoto (JP)
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Claims: