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Patent Searching and Data


Title:
THREE-DIMENSIONAL LED SUBSTRATE AND LED LIGHTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/129415
Kind Code:
A1
Abstract:
A three-dimensional LED substrate comprising: at least one LED element; a silicon substrate on which the LED element is mounted through a microbump and which has, formed therein, a wiring line that is connected to the microbump; a heat-insulating organic substrate which is bound to a surface of the silicon substrate which is opposed to the surface having the LED element mounted thereon, and which has a through-hole through which the wiring line is passed; a chip-mounting substrate which is bound to a surface of the heat-insulating organic substrate which is opposed to the silicon substrate side surface, and which has, formed therein, a wiring line that is connected to the wiring line placed in the through-hole in the heat-insulating organic substrate; and an LED control circuit chip which is connected to the wiring line in the chip-mounting substrate through the microbump, and which is mounted on a surface of the chip-mounting substrate which is opposed to the heat-insulating organic substrate side surface through the microbump.

Inventors:
TOHYAMA NAOYA (JP)
INOUE TAKUYA (JP)
KUMAGAI KOUICHI (JP)
KUNIEDA TAKAHA (JP)
Application Number:
JP2011/059311
Publication Date:
October 20, 2011
Filing Date:
April 14, 2011
Export Citation:
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Assignee:
LIQUID DESIGN SYSTEMS INC (JP)
TOHYAMA NAOYA (JP)
INOUE TAKUYA (JP)
KUMAGAI KOUICHI (JP)
KUNIEDA TAKAHA (JP)
International Classes:
H01L33/64; F21S2/00; F21V29/15; F21Y101/02
Foreign References:
JP2006313717A2006-11-16
JPH06314863A1994-11-08
JPH0548073A1993-02-26
Attorney, Agent or Firm:
YAMAMOTO, TAKAO (JP)
Takao Yamamoto (JP)
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Claims: