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Title:
THREE-DIMENSIONAL MOLDING TRANSFER FILM AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/159684
Kind Code:
A1
Abstract:
Provided is a three-dimensional molding transfer film that has excellent moldability, excellent scratch resistance, and can suitably apply a highly glossy design to a resin molded article. The three-dimensional molding transfer film comprises at least a protection layer on a transfer substrate, wherein the protection layer is formed of cured material of an ionizing radiation curable resin composition containing polycarbonate (meta)acrylate, and the protection layer has a Martens hardness of 6 N/mm2 or more and 40 N/mm2 or less. Alternatively, the three-dimensional molding transfer film comprises a transfer layer on a mold releasing layer of a support body having a transfer substrate and the mold releasing layer, wherein the mold releasing layer has a Martens hardness of 7 N/mm2 or more and 45 N/mm2 or less.

Inventors:
OOTA NAOKI (JP)
NODA AKIHISA (JP)
YOKOYAMA DAISUKE (JP)
NAKATSUGAWA YUJI (JP)
Application Number:
PCT/JP2018/007522
Publication Date:
September 07, 2018
Filing Date:
February 28, 2018
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B44C1/17; B32B7/02; B32B7/06; B32B27/00; B32B27/30
Domestic Patent References:
WO2015147056A12015-10-01
Foreign References:
JP2012056236A2012-03-22
JP2013111929A2013-06-10
JP2014069520A2014-04-21
JP2017177615A2017-10-05
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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