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Title:
THREE-DIMENSIONAL MULTI-LAYER ELECTRONIC DEVICE PRODUCTION METHOD AND THREE-DIMENSIONAL MULTI-LAYER ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/102522
Kind Code:
A1
Abstract:
This three-dimensional multi-layer electronic device production method comprises: a unit-forming step of forming multi-layer units, each containing an electronic component and circuit wiring, via 3D additive manufacturing; and a unit-layering step of layering the multi-layer units in the vertical direction into a single unit to produce a three-dimensional multi-layer electronic device.

Inventors:
TOMINAGA RYOJIRO (JP)
Application Number:
PCT/JP2017/041814
Publication Date:
May 31, 2019
Filing Date:
November 21, 2017
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H05K3/46; B29C64/112; B33Y10/00; B33Y80/00
Domestic Patent References:
WO2016042657A12016-03-24
Foreign References:
JPH09199526A1997-07-31
JP2017135364A2017-08-03
JP2002359343A2002-12-13
US20140246227A12014-09-04
US20150102484A12015-04-16
JP2017130553A2017-07-27
JPH11514304A1999-12-07
Other References:
See also references of EP 3716741A4
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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