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Title:
THREE-DIMENSIONAL PROCESSING METHOD OF FILM
Document Type and Number:
WIPO Patent Application WO/2020/013047
Kind Code:
A1
Abstract:
Provided is a three-dimensional processing method for forming recessed parts on a film by subjecting the film to cold compression-molding with a molding processing part, wherein the processing width of the molding processing part is within a range of 0.2-2 mm (exclusive of 2 mm), the amount of compression by the molding processing part is at most 30% of the thickness of the film, and thereby excellent decorative three-dimensional patterns can be formed.

Inventors:
AIKAWA TAKAYUKI (JP)
NYUU KEISUKE (JP)
Application Number:
PCT/JP2019/026451
Publication Date:
January 16, 2020
Filing Date:
July 03, 2019
Export Citation:
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Assignee:
TOYO SEIKAN KAISHA LTD (JP)
International Classes:
B31B70/88; B31F1/07
Foreign References:
JP2004175408A2004-06-24
JPH07206012A1995-08-08
JP2001219486A2001-08-14
JPH07156532A1995-06-20
JP2014046655A2014-03-17
JPH08512013A1996-12-17
JP2016007764A2016-01-18
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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