Title:
THREE-DIMENSIONAL RESIN-MOLDED CIRCUIT COMPONENT, PRODUCTION METHOD THEREFOR, AND INTERMEDIATE PART FOR PLATING
Document Type and Number:
WIPO Patent Application WO/2019/130861
Kind Code:
A1
Abstract:
The invention allows a conductor circuit pattern to be formed simultaneously or sequentially on a plurality of resin-molded bodies and also forms the conductor circuit pattern on the surface of a through-hole, or the like. With respect to a three-dimensional resin-molded circuit component A according to the invention, a hydrophilic region 4 having a pattern corresponding to the intended conductor circuit pattern 3 is formed on a resin-molded body 1 serving as a substrate. Therefore, a conductive foundation layer 5 comprising metal particles to be formed in the hydrophilic region 4 can be formed by simply bringing the resin-molded body 1 into contact with a metal particle dispersion solution containing metal particles acting as catalytic nuclei. The conductor circuit pattern comprising the conductive foundation layer 5 and a metal plating layer 6 formed thereon can be formed without having to employ laser machining, masking, etching, and other special processes, as had been the case in the prior art.
Inventors:
SEKITOMI YUJI (JP)
TAKEUCHI KUNIHITO (JP)
SAWAMURA KAZUMI (JP)
HAGA TSUYOSHI (JP)
SHIMIZU SHINYA (JP)
TAKEUCHI KUNIHITO (JP)
SAWAMURA KAZUMI (JP)
HAGA TSUYOSHI (JP)
SHIMIZU SHINYA (JP)
Application Number:
PCT/JP2018/041885
Publication Date:
July 04, 2019
Filing Date:
November 12, 2018
Export Citation:
Assignee:
MATSUO IND INC (JP)
IMUZAK INC (JP)
IBUKI INC (JP)
ELEPHANTECH INC (JP)
IMUZAK INC (JP)
IBUKI INC (JP)
ELEPHANTECH INC (JP)
International Classes:
H05K3/18; H05K1/02; H05K1/16; H05K3/00; H05K5/02
Foreign References:
| US20130180773A1 | 2013-07-18 | |||
| JP2010239259A | 2010-10-21 | |||
| JPH062822U | 1994-01-14 |
Attorney, Agent or Firm:
MUGISHIMA Takashi (JP)
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