Title:
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/178203
Kind Code:
A1
Abstract:
A three-dimensional semiconductor device in which a plurality of semiconductor elements are stacked is provided with a substrate (10) on which a first semiconductor element (20) is formed, an interlayer film (30) that is formed on the substrate (10), a channel layer (50) that is formed on the interlayer film (30), and a second semiconductor element that is formed on the channel layer (50). In addition, the interlayer film (30) comprises at least a light-blocking layer (34).
Inventors:
USUDA KOJI (JP)
TEZUKA TSUTOMU (JP)
TEZUKA TSUTOMU (JP)
Application Number:
PCT/JP2014/051220
Publication Date:
November 06, 2014
Filing Date:
January 22, 2014
Export Citation:
Assignee:
TOSHIBA KK (JP)
International Classes:
H01L27/00; H01L21/20; H01L21/336; H01L21/8234; H01L27/088; H01L29/786
Foreign References:
| JP2006210828A | 2006-08-10 | |||
| JP2006261180A | 2006-09-28 | |||
| JPH0851076A | 1996-02-20 | |||
| JP2007311541A | 2007-11-29 | |||
| JP2000150893A | 2000-05-30 | |||
| JP2006032646A | 2006-02-02 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
Masatoshi Kurata (JP)
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