THREE-DIMENSIONAL SHAPING METHOD AND THREE-DIMENSIONAL SHAPING DEVICE

WIPO Patent Application WO/2021/079553

A1

[Problem] To provide a configuration capable of performing efficient and uniform three-dimensional shaping using two-dimensional scanning, in which all laser beams that are scanned upon being transmitted through a plurality of galvanoscanners contribute to formation of a sintered surface. [Solution] The above problem is solved by a three-dimensional shaping method and device that utilize a plurality of galvanoscanners 3 that realize scanning of laser beams 7 along a two-dimensional direction of orthogonal coordinates or cylindrical coordinates by reflection from a first mirror 31, which vibrates via a rotation shaft 30 that is orthogonal to a transmission direction of the laser beams 7 transmitted through a dynamic focus lens 2, and from a second mirror 32, which vibrates via a horizontal rotation shaft 30 that is orthogonal to the rotation shaft 30 of the first mirror 31. The range of the vibration is made freely adjustable on the basis of control of the vibration, and then a region on a sintered surface 6 of a focus point or a nearby position thereof of the laser beams 7 that are irradiated from a direction inclined with respect to the surface of a table 4 is made freely selectable.

AMAYA KOICHI (JP)
YOSHIDA MITSUYOSHI (JP)
TOMITA SEIICHI (JP)
SASAKI SHOTA (JP)

PCT/JP2020/022518

April 29, 2021

June 08, 2020

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TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)

B22F3/16; B22F3/105; B29C64/153; B29C64/268; B29C64/277; B33Y10/00; B33Y30/00

JP2009006509A	2009-01-15
JP2014136329A	2014-07-28
JP2003127238A	2003-05-08
JPH06192702A	1994-07-12
US20130270750A1	2013-10-17

AKAO Naoto (JP)

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