Title:
THREE-DIMENSIONAL STRUCTURAL BODY MANUFACTURING METHOD, MOLD USED IN SAME, AND ELECTRIC CONTACT
Document Type and Number:
WIPO Patent Application WO/2017/069136
Kind Code:
A1
Abstract:
In the present invention, using a mold having a shape in which the center portion of a prescribed region is recessed, the surface shape of a leading end of a three-dimensional structure is pressed into a resin plate to mold the same, and a metal layer is formed on the surface of the molded plate, thereby manufacturing a three-dimensional structural body.
Inventors:
NAGATA HITOSHI (JP)
FAN LIWEN (JP)
FAN LIWEN (JP)
Application Number:
PCT/JP2016/080902
Publication Date:
April 27, 2017
Filing Date:
October 19, 2016
Export Citation:
Assignee:
JAPAN ELECTRONIC MATERIALS (JP)
RITSUMEIKAN TRUST (JP)
HORIGUCHI IRON WORKS INC (JP)
RITSUMEIKAN TRUST (JP)
HORIGUCHI IRON WORKS INC (JP)
International Classes:
G01R1/067; B29C33/42; C25D5/02
Domestic Patent References:
| WO2000059274A1 | 2000-10-05 |
Foreign References:
| JP2006337202A | 2006-12-14 | |||
| JP2008089377A | 2008-04-17 | |||
| JPH09267337A | 1997-10-14 | |||
| JP2004291472A | 2004-10-21 | |||
| JPH07191057A | 1995-07-28 |
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
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