Title:
THREE-DIMENSIONAL WAFER SURFACE WASHING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/006753
Kind Code:
A1
Abstract:
Disclosed is a three-dimensional wafer surface washing device for removing foreign substances present on the surface of a three-dimensional wafer having a three-dimensional structure formed on the surface thereof. The three-dimensional wafer surface washing device comprises: a wafer support part for supporting a three-dimensional wafer; and a CO2 dry ice spray unit forming, in a washing nozzle or in the vicinity thereof, solid CO2 dry ice through the adiabatic expansion of liquid CO2, and spraying the solid CO2 dry ice at a surface of the three-dimensional wafer through the washing nozzle, wherein the CO2 dry ice spray unit includes a liquid CO2 supply part for supplying the liquid CO2 to the washing nozzle, and an accelerated clean air supply part for supplying clean air to the washing nozzle.
Inventors:
LEE JONG MYOUNG (KR)
LEE KYU-PIL (KR)
LEE KYU-PIL (KR)
Application Number:
PCT/KR2014/007857
Publication Date:
January 14, 2016
Filing Date:
August 25, 2014
Export Citation:
Assignee:
IMT CO LTD (KR)
International Classes:
H01L21/302; H01L21/683
Foreign References:
| JP2001259552A | 2001-09-25 | |||
| JP2009028633A | 2009-02-12 |
Attorney, Agent or Firm:
RYU, CHANGYEOL (KR)
유창열 (KR)
유창열 (KR)
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