Title:
THROUGH ELECTRODE SUBSTRATE, METHOD FOR PRODUCING THROUGH ELECTRODE SUBSTRATE AND MOUNTED BOARD
Document Type and Number:
WIPO Patent Application WO/2018/043184
Kind Code:
A1
Abstract:
This through electrode substrate is provided with: a substrate which has a first surface positioned on a first side and a second surface positioned on a second side that is opposite to the first side, while being provided with a through hole; and a through electrode. The through electrode has: a lateral wall portion which extends along the lateral wall of the through hole; and a first portion which is positioned on the first surface of the substrate and is connected to the lateral wall portion. This through electrode substrate is additionally provided with: an organic film which is positioned inside the through hole; an inorganic film which at least partially covers the first portion of the through electrode from the first side, while being provided with an opening that is positioned above the first portion; and a first wiring layer which comprises an insulating layer that is positioned closer to the first side than the inorganic film and contains at least an organic layer having an opening that is in communication with the opening of the inorganic film and a conductive layer that is connected to the first portion of the through electrode via the opening of the inorganic film and the opening of the insulating layer.
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Inventors:
MAEKAWA SHINJI (JP)
KUDO HIROSHI (JP)
TAKANO TAKAMASA (JP)
MAWATARI HIROSHI (JP)
ASANO MASAAKI (JP)
KUDO HIROSHI (JP)
TAKANO TAKAMASA (JP)
MAWATARI HIROSHI (JP)
ASANO MASAAKI (JP)
Application Number:
PCT/JP2017/029819
Publication Date:
March 08, 2018
Filing Date:
August 21, 2017
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H05K1/11; H01L21/3205; H01L21/768; H01L23/12; H01L23/522; H05K3/40
Foreign References:
| JP2010258320A | 2010-11-11 | |||
| JP2014168007A | 2014-09-11 | |||
| JP2002151819A | 2002-05-24 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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