Title:
THROUGH HOLE BORING METHOD AND BORING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/145155
Kind Code:
A1
Abstract:
Provided are a through hole boring method and a through hole boring apparatus,
which are enabled, by using a press-punching method, to improve productivities
and qualities even for a thick work and to reduce working costs drastically.
The through hole boring apparatus bores a through hole (70) in the circumferential
wall (15) of such a cylindrical portion (12) of a work (10) as has two open ends,
by the press-punching method using a die (20) and a punch (30). The apparatus
comprises a punch holder (32) having the punch (30) protruding from its side face
and adapted to be so inserted into the inside of the cylindrical portion (12) of
the work (10) that two end portions (35a, 35b) may be exposed to the outside, a guide
portion (45) for directly guiding the punch holder (32) movably in the press-punching
direction, and push means (50) for pushing the two end portions (35a, 35b) of the
punch holder (32) to move the punch holder (32) along the guide portion (45) so
that it may press the punch (30) into the circumferential wall (15) from the inside
of the cylindrical portion (12) thereby to bore the through hole (70).
Inventors:
UENO EIZOU (JP)
Application Number:
PCT/JP2007/061696
Publication Date:
December 21, 2007
Filing Date:
June 11, 2007
Export Citation:
Assignee:
UENO EIZOU (JP)
International Classes:
B21D28/34; B21D28/28
Foreign References:
JPS5934819U | 1984-03-03 | |||
JP2005059063A | 2005-03-10 | |||
JP2006136892A | 2006-06-01 | |||
JPH07323383A | 1995-12-12 | |||
JP2000017399A | 2000-01-18 | |||
JP2002301523A | 2002-10-15 |
Attorney, Agent or Firm:
KOBAYASHI, Tsunenori (Oaza Nakano Nakano-sh, Nagano 13, JP)
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