Title:
THROUGH-HOLE PLATING METHOD AND SUBSTRATE MANUFACTURED USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/117533
Kind Code:
A1
Abstract:
Using a substrate intermediate (4) having through-holes (7) passing through an insulating layer (6) and two electroconductive masks (5) having openings at positions corresponding to the through-holes (7), the entirety of front and rear surfaces of the substrate intermediate (4) is covered by the electroconductive masks (5) such that the positions of the openings are in alignment with the through-holes (7), and the electroconductive masks (5) are caused to adhere tightly to at least some of the front and rear surfaces of the substrate intermediate (4) so that an article to be plated (2) is formed. The article to be plated (2) is dipped in a plating liquid (3), a metal is deposited on the entire front surface of the plated article (2) including inner surfaces of the through-holes (7) so that a plating treatment is performed, and the electroconductive masks (5) are removed from the substrate intermediate (4).
Inventors:
TANEKO NORIAKI (JP)
SAITO YOICHI (JP)
TAKII SHUKICHI (JP)
SAITO YOICHI (JP)
TAKII SHUKICHI (JP)
Application Number:
PCT/JP2011/054725
Publication Date:
September 07, 2012
Filing Date:
March 02, 2011
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
TANEKO NORIAKI (JP)
SAITO YOICHI (JP)
TAKII SHUKICHI (JP)
TANEKO NORIAKI (JP)
SAITO YOICHI (JP)
TAKII SHUKICHI (JP)
International Classes:
C25D5/02; C25D7/00; C25D17/10; H05K3/42
Foreign References:
| JPH10173337A | 1998-06-26 | |||
| JP2003309356A | 2003-10-31 | |||
| JP2007059796A | 2007-03-08 | |||
| JPS5989783A | 1984-05-24 |
Attorney, Agent or Firm:
NAGATO, KANJI (JP)
Nagato δΎƒ 2 (JP)
Nagato δΎƒ 2 (JP)
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Claims: