Title:
TIN ALLOY PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2020/021965
Kind Code:
A1
Abstract:
A tin alloy plating solution which contains a soluble tin salt, a soluble salt of a metal that is more noble than tin, and a sulfide compound that is represented by general formula (1). In general formula (1), (A) represents a hydrocarbon group having 1-2 carbon atoms and no oxygen atom, or alternatively, (A) represents a hydrocarbon group having 2-6 carbon atoms and one or more oxygen atoms. It is preferable that the metal that is more noble than tin is silver, copper, gold or bismuth.
Inventors:
TATSUMI KOJI (JP)
Application Number:
PCT/JP2019/025888
Publication Date:
January 30, 2020
Filing Date:
June 28, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D3/60; C07C321/14; C07C321/28
Foreign References:
| JP2017031447A | 2017-02-09 | |||
| JP2000192279A | 2000-07-11 | |||
| JP2001164396A | 2001-06-19 | |||
| JP2003171789A | 2003-06-20 | |||
| JP2018141146A | 2018-09-13 | |||
| JP2019119213A | 2019-07-22 | |||
| JPH11269691A | 1999-10-05 | |||
| JP2000192279A | 2000-07-11 | |||
| JP2006265572A | 2006-10-05 | |||
| JP2007046142A | 2007-02-22 |
Other References:
See also references of EP 3835458A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF: