TIN ELECTROPLATING BATH AND TIN PLATING FILM

Title:

TIN ELECTROPLATING BATH AND TIN PLATING FILM

Document Type and Number:

WIPO Patent Application WO/2015/190390

Kind Code:

A1

Abstract:

Provided is a tin electroplating bath for obtaining a tin plating film for which the occurrence of tin whiskers when an external stress is applied on the tin plating film is limited. The tin electroplating bath is characterized in comprising at least one kind of compound selected from a group consisting of flavonoid compounds and glycosides thereof, compounds with a xanthene backbone and glycosides thereof, and compounds with an acridine backbone and glycosides thereof.

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Inventors:

KANO TOSHIKAZU (JP)
IKUMOTO RAIHEI (JP)
TSUJIMOTO MASANOBU (JP)

Application Number:

PCT/JP2015/066187

Publication Date:

December 17, 2015

Filing Date:

June 04, 2015

Export Citation:

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Assignee:

UYEMURA C & CO LTD (JP)

International Classes:

C25D7/00; C25D3/32

Foreign References:

JPH1060682A	1998-03-03
JP2010174373A	2010-08-12

Other References: