Title:
TIN OXIDE POWDER FOR ITO SPUTTERING TARGET, PRODUCTION METHOD OF THE POWDER, SINTERED BODY SPUTTERING TARGET FOR ITO FILM FOMATION AND PRODUCTION METHOD OF THE TARGET
Document Type and Number:
WIPO Patent Application WO/2002/072912
Kind Code:
A1
Abstract:
Tin oxide powder for ITO sputtering target, characterized in that a median diameter obtained from a particle size distribution ranges from 0.40 to 1.0 $g(m)m, and a 90% particle size obtained from a particle size distribution is up to 3.0 $g(m)m. Tin oxide powder that can provide a sintered body having excellent density enhancing feature and component uniformity which are suitable for ITO thin film formation, and an ITO film forming sputtering target sintered by using the powder, whereby it is possible to produce at low costs an ITO film forming tin oxide-indium oxide target that can restrict nodules from being generated at ITO thin film forming and their attendant deterioration in thin film quality.
Inventors:
KONAKA MITSUYUKI
KURIHARA TOSHIYA
KURIHARA TOSHIYA
Application Number:
PCT/JP2002/001305
Publication Date:
September 19, 2002
Filing Date:
February 15, 2002
Export Citation:
Assignee:
NIKKO MATERIALS CO LTD (JP)
International Classes:
C01G19/00; C01G19/02; C23C14/08; C23C14/34; (IPC1-7): C23C14/34; C01G19/00
Foreign References:
| US6033620A | 2000-03-07 | |||
| JPH1030173A | 1998-02-03 | |||
| JP2000345329A | 2000-12-12 | |||
| JP2001072468A | 2001-03-21 | |||
| JP2001072470A | 2001-03-21 |
Attorney, Agent or Firm:
Ogoshi, Isamu (Toranomon 9 Mori Building 3F 2-2, Atago 1-chom, Minato-ku Tokyo, JP)
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