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Title:
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PART STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/090638
Kind Code:
A1
Abstract:
On a substrate 2 made of copper or a copper alloy, a zinc-nickel alloy layer 4 containing zinc and nickel, and a tin layer 5 made of a tin alloy are laminated in this order, wherein the zinc-nickel alloy layer 4 has a thickness of 0.1-5 µm and has a nickel content of 5-50 mass%, the tin layer 5 has a zinc concentration of 0.6-15 mass%, and, under an oxide layer 6 which is the outermost layer, a metal zinc layer 7, having a zinc concentration of 5-40 at% and a thickness of 1-10 nm in terms of SiO2, is formed on the tin layer 5.

Inventors:
KUBOTA, Kenji (Central Research Institute 1002-14, Mukohyama, Naka-sh, Ibaraki 02, 〒3110102, JP)
TARUTANI, Yoshie (Central Research Institute 1002-14, Mukohyama, Naka-sh, Ibaraki 02, 〒3110102, JP)
NAKAYA, Kiyotaka (Central Research Institute 1002-14, Mukohyama, Naka-sh, Ibaraki 02, 〒3110102, JP)
Application Number:
JP2016/084690
Publication Date:
June 01, 2017
Filing Date:
November 24, 2016
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
International Classes:
H01R13/03; C22C18/00; C22C19/03; C25D5/10; C25D5/50; C25D7/00; H01R4/62
Domestic Patent References:
WO2013161551A12013-10-31
WO2000015876A12000-03-23
Foreign References:
JP2013033656A2013-02-14
JP2009084616A2009-04-23
JP2016169439A2016-09-23
Attorney, Agent or Firm:
AOYAMA, Masakazu (Seiyo Patent Office, 3F Shin-Chiyoda Kyodo Bldg. 3-3-9, Kandakajicho, Chiyoda-k, Tokyo 45, 〒1010045, JP)
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