Title:
TIRE AND METHOD OF MANUFACTURING TIRE
Document Type and Number:
WIPO Patent Application WO/2021/039603
Kind Code:
A1
Abstract:
Provided is a method of manufacturing a tire which, even when an electronic component is embedded in the tire, makes it possible to eliminate a worsening in uniformity and avoid producing large bumps. The method is a method of manufacturing a tire 1, the tire 1 including bead cores 21, a bead filler 22 extending outward in a tire radial direction of each of the bead cores 21, a carcass ply 23 extending from one bead core 21 to another bead core 21 and folded back around the bead cores 21, and an RFID tag 40 serving as an electronic component, the method comprising: a covering step of covering the RFID tag 40 with coated rubber 43; a recess forming step of forming, in the bead filler 22, a recess 22D having a shape corresponding to a shape of the coated rubber 43; and a disposing step of disposing the coated rubber 43, which at least partially covers the electronic component 40, in the recess 22D in the bead filler 22.
Inventors:
SUITA HARUNOBU (JP)
Application Number:
PCT/JP2020/031527
Publication Date:
March 04, 2021
Filing Date:
August 20, 2020
Export Citation:
Assignee:
TOYO TIRE CORP (JP)
International Classes:
B60C19/00; B29D30/48
Domestic Patent References:
| WO2018104623A1 | 2018-06-14 |
Foreign References:
| JP2008265750A | 2008-11-06 | |||
| US8977422B1 | 2015-03-10 | |||
| US20110175778A1 | 2011-07-21 | |||
| KR20100120505A | 2010-11-16 | |||
| JP2016539047A | 2016-12-15 | |||
| JP2016049920A | 2016-04-11 | |||
| JPH02123404U | 1990-10-11 | |||
| JPH05169931A | 1993-07-09 | |||
| JP2008265750A | 2008-11-06 |
Other References:
See also references of EP 4019291A4
Attorney, Agent or Firm:
SHIBA Tetsuo et al. (JP)
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