Title:
TIRE
Document Type and Number:
WIPO Patent Application WO/2022/181267
Kind Code:
A1
Abstract:
Provided is a tire having high peeling resistance such that an electronic component mounting member unlikely peels off from the surface of the tire even when a large impact is exerted on the tire during a high-speed travel in a low-temperature environment. In the tire, the electronic component mounting member for incorporating an electronic component is attached to the surface of a tire inner member, the electronic component mounting member comprises an electronic component storage part for storing the electronic component and a bonding part having a bonding surface for mounting the electronic component mounting member on the surface of the tire inner member, and the complex modulus of elasticity E*
r (MPa) of the bonding part at 0°C and the complex modulus of elasticity E*
i (MPa) of the tire inner member at 0°C satisfy Expression 1. Expression 1: E*
r/E*
i<1
Inventors:
AOKI DAICHI (JP)
Application Number:
PCT/JP2022/004000
Publication Date:
September 01, 2022
Filing Date:
February 02, 2022
Export Citation:
Assignee:
SUMITOMO RUBBER IND (JP)
International Classes:
B60C19/00
Domestic Patent References:
| WO2020022160A1 | 2020-01-30 |
Foreign References:
| JP2011500443A | 2011-01-06 | |||
| JPH11278021A | 1999-10-12 | |||
| JP2006306171A | 2006-11-09 | |||
| JP2007024696A | 2007-02-01 | |||
| JP2009298327A | 2009-12-24 | |||
| JP2005178761A | 2005-07-07 | |||
| JP2013508209A | 2013-03-07 | |||
| JP2018016185A | 2018-02-01 | |||
| JP2018199396A | 2018-12-20 | |||
| JP2019023594A | 2019-02-14 | |||
| JP2019026218A | 2019-02-21 |
Attorney, Agent or Firm:
JODAI Tetsuji et al. (JP)
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