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Title:
TITANIUM-COPPER FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2011/065188
Kind Code:
A1
Abstract:
Provided is titanium-copper which has excellent strength and bendability. The titanium-copper is a copper alloy for electronic components which contains 2.0-4.0 mass% Ti, the remainder comprising copper and incidental impurities. The intensity peak of X-ray diffraction from the {220} crystal plane in a rolled surface of the copper alloy has a half-value width β{220} which satisfies the relationship 3.0≤β{220}/β0{220}≤6.0, wherein β0{220} is the half-value width of the intensity peak of X-ray diffraction from the {220} crystal plane of a standard powder of pure copper. The copper alloy, in a structure examination of a section parallel to the rolling direction, has an average crystal-grain diameter of 30 µm or smaller in terms of equivalent-circle diameter.

Inventors:
ERA,Naohiko (JX Nippon Mining & Metals Corporation1-2,Shirogane-cho 1-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
江良 尚彦 (〒56 茨城県日立市白銀町1-1-2JX日鉱日石金属株式会社技術開発センター内 Ibaraki, 〒3170056, JP)
Application Number:
JP2010/069369
Publication Date:
June 03, 2011
Filing Date:
October 29, 2010
Export Citation:
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Assignee:
JX Nippon Mining & Metals Corporation (6-3Otemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
JX日鉱日石金属株式会社 (〒04 東京都千代田区大手町二丁目6番3号 Tokyo, 〒1000004, JP)
ERA,Naohiko (JX Nippon Mining & Metals Corporation1-2,Shirogane-cho 1-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
International Classes:
C22C9/00; C22F1/08; H01B13/00; C22F1/00; C22F1/02
Attorney, Agent or Firm:
AXIS Patent International (Yushi Kogyo Kaikan, 13-11 Nihonbashi 3-chome, Chuo-k, Tokyo 27, 〒1030027, JP)
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