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Title:
TITANIUM COPPER FOIL, EXTENDED COPPER ARTICLE, ELECTRONIC DEVICE COMPONENT, AND AUTO-FOCUS CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2020/095508
Kind Code:
A1
Abstract:
Provided is a titanium copper foil, which has the high strength required when used as a spring as well as good etching properties and low permanent set, and which can be used suitably as an electrically conductive spring material to be used in an electronic device component such as an auto-focus camera module. This titanium copper foil contains Ti at 1.5-5.0 mass%, the balance comprising Cu and unavoidable impurities. In a Ti concentration curve obtained by analyzing a cross-section parallel to the rolling direction along the thickness direction by STEM-EDX, low concentration Ti layers in which the Ti concentration was less than the average Ti concentration value in the Ti concentration curve and high concentration Ti layers in which the Ti concentration was higher than or equal to the average Ti concentration value in the Ti concentration curve were disposed alternately in the thickness direction. With regard to HH and HL defined in the description, 1.0 mass%≤HH≤30 mass% and HH/HL≥1.1 are satisfied.

Inventors:
TSUJIE KENTA (JP)
Application Number:
PCT/JP2019/032486
Publication Date:
May 14, 2020
Filing Date:
August 20, 2019
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C22C9/00; C22F1/08; G02B7/04; C22F1/00
Domestic Patent References:
WO2018180428A12018-10-04
WO2018180429A12018-10-04
Foreign References:
JP2012097306A2012-05-24
JP2015098622A2015-05-28
JP2004280031A2004-10-07
JP2009115895A2009-05-28
JP2015098622A2015-05-28
JP2015127438A2015-07-09
JP2002356726A2002-12-13
JP2004091871A2004-03-25
JP2010126777A2010-06-10
JP2011208243A2011-10-20
JP2014173145A2014-09-22
JP2014037613A2014-02-27
JP2014080670A2014-05-08
JP2014074193A2014-04-24
JP2016050341A2016-04-11
Other References:
See also references of EP 3878988A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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