[001] This application claims the benefit of U.S. Provisional Application No.

61/301 ,477, filed Feb. 4, 2010; U.S. Provisional Application No. 81/259,008, filed Nov. 6, 2009; and U.S. Provisional Application No. 61/234,910, filed Aug. 18, 2009, the disclosures of each are incorporated by reference herein.

TECHNICAL FIELD

[002] The disclosure relates generally to a containment apparatus and method useful for collecting and treating metal oxides (dross) formed in a soldering process, as well as for reclaiming solder from the dross.

[003] Wave soldering is a process commoniy employed to automaficaily solder electronic components, e.g., in a printed circuit board. Typically, the wave soldering machine includes a solder reservoir or bath in which a supply of molten solder is maintained at a preset temperature. A solder wave is typically produced by pumping molten solder upward through at least one solder wave nozzle arranged in the solder reservoir to produce a solder wave. A printed circuit board is passed over the top of the solder wave to skim its surface, such that conductive solder joints are formed between the components and the printed circuit board, [004] One problematic aspect of wave soldering (and other soldering techniques as well) is the formation of dross, i.e., metal oxides formed from metals contained within the molten solder. Dross forms upon exposure of molten solder to air (namely the oxygen in air), by oxidizing metals within the solder to their corresponding oxides. Turbulence in the solder wave is also a significant contributor to dross formation. Dross formation can, among other things, change the height of the solder wave, which can adversely impact the quality of the solder joints, e.g., in a finished circuit board, result in significant operating losses due to time required for cleaning and maintenance of the solder bath and dross removal, and can also result in increased soldering costs due to solder losses.

ATL IMΛNAUb-7?52804 1 [005] Various approaches have been described for removing dross from a solder pot or preventing its formation such as the use of vegetable or other oils, or an inert atmosphere such as nitrogen, to provide a blanket on the solder surface, addition of solid separating agents such as rice bran (see U.S. Patent No.

8,214,218), and the like. In the method described in U.S. Patent No. 8,214,218, the solder oxides floating on molten solder are scooped up and placed in a netted basket having openings from 1-10 mm ² . The solid separating agent is dusted on top of the collected solder oxides. The solid separating agent carbonizes or oxidizes on contact with the molten solder so the usable solder is released.

Unfortunately, none of the foregoing approaches has resulted in a commercially viable process for significantly reducing solder use/consumption, while

accompanied by ease of use, the need for minimal modification to on-going solder operations/manufacturing lines, and the assimilation of dross into a distinct, and preferably liquid, additive layer. In an effort to address the problems associated with dross formation and its adverse impact on soldering operations, the Applicant has provided an elegant solution capable of achieving the foregoing features as described in U, S. Patent Publication No. 2005/0230457 entitled, "Soldering Process". Described therein is a liquid additive, which, when introduced onto a solder bath, is capable not only of forming an oxygen barrier to prevent or minimize formation of dross, but is also effective to scavenge metal oxides from the solder bath, and moreover, assimilate such oxides therein - to essentially consume such oxides while restoring entrained metals back to the solder bath. In an exemplary embodiment, the liquid additive comprises dimer acid(s).

[006] The current and most commonly employed approach when using a liquid additive such as that described above is to add liquid additive directly to the solder bath to obtain optimal soldering performance. While such an approach successfully removes and treats dross directly in the solder bath, i.e.. in situ, users have expressed concerns, albeit unfounded, regarding the potential for

contamination, i.e., exposure of the solder joint to the liquid additive (although data has shown no trace of additive in the resulting solder joints). In the above process, the liquid additive remains in the solder bath and is not contacted with the solder that is applied to the object to be soldered, such as a circuit board.

[007] Provided herein is a solder tool and related methods which not only confine the additive to an isolated area of the solder bath, and can be employed

ATL IMΛNAGE-7252S04 I O off-line separate from the solder apparatus, if desired, but in addition, provide the additional benefits of reduced down time due to associated cleaning and

maintenance of a smaller area, significant cost savings due to the need for smailer quantities of additive, less additive waste, and improved visual inspection of dross consumption, among other advantages to be described more fully below.

[008] The following aspects and embodiments described and illustrated below are meant to be exemplary and illustrative, not limiting in scope.

[009] In one aspect, provided herein is a solder dross removal apparatus.

The solder dross removal apparatus is, in its simplest form, a receptacle for collecting and preferably treating dross. The receptacle can be of any size or shape, depending upon whether its use is off-line or as part of the solder reservoir. In a preferred embodiment, the solder dross removal apparatus forms a

removable part of the solder reservoir, such that the bottom of the receptacle sits below the solder surface (e.g., from about two to four inches below the solder surface) during both solder apparatus operation, and removal and treatment of dross. In another embodiment, the bottom of the receptacle is raised above the level of the solder surface during treatment and/or removal of dross. In such an instance, its size is suitably adjusted based upon the dimensions of the soldering machine and/or reservoir. Typically, but not required, operation of the soldering apparatus is stopped during dross removal and treatment as described herein.

[010] In yet another aspect, provided herein is a solder dross removal (and treatment) apparatus comprising (i) a receptacle for collecting dross having four sides and a bottom, where at least a portion of the bottom is an apertured section having a plurality of apertures, and (ii) a lift member operatively coupled to the receptacle to maneuver the receptacle within the solder bath. In one embodiment, the apparatus is formed of stainless steel. It will, however, be understood that the solder dross removal apparatus may take on any shape convenient for use in or in conjunction with the solder bath, and that the foregoing shape is meant to be purely illustrative.

[011] In a particular embodiment of the foregoing, at least 25% of the bottom area of the solder dross removal apparatus comprises an apertured section. In yet another embodiment, the apertured section forms about 20-25% of the area of the bottom of the receptacle.

ATL i?viANAGE-72528(M 1 -a [012] In yet a related embodiment, at least one of the sides of the soider dross removal apparatus includes an apertured section, e.g., situated at the bottom of the side. For instance, the apertured section may be contained within the bottom half of the side, or within the bottom third of the side, or within the bottom fourth of the side, and so on.

[013] In yet another embodiment, one, two, three or four sides of the solder dross removal apparatus include a bottom apertured section, In the event that the soider dross removai apparatus is of a shape having a number of sides unequal to four, or possesses rounded sides or the like, such continuous side portion may possess an apertured section. That is to say, any number of the total number of sides may include an apertured section, up to and including all of the sides, or for a rounded receptacle, any bottom portion of the entire area of the side wall may be apertured (e.g., 5%, 10%, 20%, 30%, 40%, 50%, 80% or more).

[014] In yet a further embodiment, at least one of the sides includes an extended side portion that extends about 1-3" above the height of the non- extended side(s) of the apparatus. In a particular embodiment, two of the sides includes an extended side portion as described above. In yet a further embodiment, three of the sides includes an extended side portion. In yet another embodiment, the extended side portions are apertured.

[015] In yet another embodiment, the apertured section(s) is formed of perforated sheet metal having openings of 0.08" to 0.187". In another embodiment, the apertures are holes having a diameter of about 0.118" ± 0.010". Typically, the apertures are of a diameter effective to (i) allow purified solder to flow into the solder bath, and (ii) retain spent liquid additive, dross, and treated dross within the receptacle. In a particular embodiment, the sheet metal is stainless steel or titanium.

[016] in yet a further embodiment, the lift member includes a retention portion for coupling the apparatus to a solder reservoir. In one embodiment, the retention portion includes a horizontal section of suitable dimension to fit over a side of the solder bath and a vertical section connected to the horizontal section to retain the apparatus on the side of the soider bath. The retention portion may include an adjuster to adjust the height of the receptacle with respect to the solder level. In another embodiment, the lift section further includes a handle.

ATL IMANΛGH-7252804 I [017] In yet another embodiment, the apparatus is used in conjunction with an organic liquid active additive that assimilates oxide of at least one metal in the solder bath. In another embodiment, the apparatus is used with an organic liquid active additive that comprises dimer acids, where the additive assimilates oxide of at least one metal in the bath. In yet another embodiment, the apparatus is used for treating dross formed in a solder bath by addition of an organic liquid additive that assimilates oxide of at least one metal in the bath to the receptacle comprising solder and dross.

[018] In one or more further embodiments, provided herein is a solder dross removal apparatus according to any one of Figs. 1A, 1 B, 3A, 3B, 3C, 3D ₁ or 3E.

[019] In yet another aspect, provided herein is a method for treating and removing dross formed in a soldering process. In the method, a solder dross removal apparatus is mounted to the solder reservoir. Dross that has formed as part of the soldering operation is placed into the solder dross removal receptacle. Hn one embodiment, the apparatus is removably contained within the solder apparatus, or alternatively, the solder apparatus is off-line. During operation of the soldering apparatus, the dross removal receptacle is generally mounted within the solder apparatus, e.g., such that the bottom of the receptacle is below the surface of the molten solder. In another embodiment, the dross removal receptacle is generally mounted within the solder apparatus such that the bottom of the receptacle is above the surface of the molten solder. The dross is added to the receptacle by any fashion - i.e., automatically or manually. Most simply, dross that has formed is scooped or moved (i.e., manually removed) from the surface of the molten solder and manually placed into the dross removal receptacle which forms part of the solder apparatus, e.g., using a ladle, spoon, spatula, or the like. In one embodiment, the dross is first moved to an area of the solder pot in proximity to the solder dross removal receptacle, followed by placement into the solder dross removal receptacle. In yet another embodiment, a barrier or dam is placed within the solder apparatus to protect the motor area, e.g.. from dross, additives and the like, preferably prior to dross collection.

[020] In a particular embodiment, prior to placement of dross within the solder dross removal receptacle, the receptacle is lifted from its base level within the solder apparatus such that at least one side is above the level of the solder

A M IMANAGL-7?52Sυ4 I z surface to retain the dross, additive, and treated dross within the receptacle. In one embodiment, the bottom of the receptacle remains below the solder surface. In yet a related embodiment, the receptacle, upon lifting, may sit upon a lift member or lever to thereby raise and lower the level of the receptacle within the solder apparatus. Aiternatively, the receptacle is lifted from its base level within the solder apparatus such that the bottom of the receptacle is raised above the solder surface.

[021] In yet another embodiment, a bottom portion of the receptacle

(including the bottom and lower portion of the sides) is apertured, to thereby allow solder to flow through. In such embodiment, the apertured section will typically comprise anywhere from about the bottom only of the receptacie to the bottom half of the receptacle, including one or more of its sides as described in greater detail herein.

[022] A suitable amount of additive is added to the dross-containing receptacle, to thereby consume or assimilate the dross therein. Particularly preferred additives for combined use with the instant solder dross removal receptacie are those described in Applicant's U.S. Patent Publication No. 2005/0230457, and international Patent Publication Nos. WO 2005/110657 and WO 2006/032006, the contents each of which are expressly incorporated herein by reference in their entirety. In a preferred embodiment, the additive is a liquid additive, in another embodiment, the additive is an organic liquid active additive. In a specific embodiment, the organic liquid active additive (i) comprises nucleophilic and/or electrophilic groups, and (ii) assimilates oxide of at least one metal in the solder bath. In yet another embodiment, the additive is a liquid surfactant. In yet an additional embodiment, the liquid additive comprises dimer or trirner acids.

[023] In yet a further embodiment, the additive is MS2® Molten Solder

Surfactant.

[024] In an alternative embodiment, the additive is a liquid additive as described in Chinese Patent Publication No. CN101215712. In the foregoing embodiment, the additive comprises nonyi phenol polyoxyethylene ether, cyclohexyiamine hydrobromate, diphenyi guanidine hydrobromate, phosphoric acid, and phytic acid. In an embodiment, an amount of additive is added that is

ATL IMAN AGE-7252804. J 6 sufficient to consume or assimilate the solder dross added to the removal apparatus.

[025] In yet another embodiment, the additive is mixed with the dross by any suitable mixing means in the solder dross removal receptacle. Preferably, the additive is sufficiently effective to allow hand mixing, such as with a spoon or spatula, although any suitable manner of mixing may be employed, e.g., use of an agitator. Preferably, addition of the additive and subsequent mixing is effective to consume the dross, thereby releasing formerly bound metal back into the solder bath, e.g., through the apertures, while maintaining or capturing the resultant treated dross or residues, in the solder dross removal receptacle. The treated residues are then removed from the receptacle, taking care to remove only treated residues and spent additive rather than solder. The receptacle may be raised above the level of the molten solder before the treated residues are removed to allow purified solder to flow into the bath. Removing the treated residues may include removing the receptacle from the solder bath to empty the spent additive, treated dross and any untreated oxides from the receptacle.

[026] The foregoing steps are then repeated as necessary, ideally until the solder pot is visually observed to be substantially free of dross.

[027] The foregoing apparatus and method provides several advantages over existing methods including but not limited to the following. Treatment of metal oxides in a confined space limits the exposure of the soldering machine to additive, which can, in turn, reduce apparatus cleaning/maintenance times. Greater ease of removal of additive residues and spent additive, due to their containment, further increases ease of operability. Moreover, the small and optima! number of features of the containment apparatus and related method lend to its balance of effectiveness, efficiency and ease of use. Finally, use of the solder dross removal receptacle results in notable additive consumption savings, due to an enhanced ability to assess the amount of additive needed to consume/assimilate dross in a smaller containment area relative to its application upon the surface of the entire solder bath, or even a portion thereof. In an exemplary embodiment, additive consumption savings of up to about 40% have been observed.

[028] Exemplary embodiments of the foregoing will now be described.

Additional embodiments of the apparatus and related methods and the like will be

ATL IMANAGF- 7252804 ϊ -? apparent from the following description and examples. As can be appreciated from the foregoing and following description, each and every feature described herein, and each and every combination of two or more of such features, is included within the scope of the present disclosure provided that the features inciuded in such a combination are not mutually inconsistent. In addition, any feature or combination of features may be specifically excluded from any embodiment of the present invention. Additional aspects and advantages of the present invention are set forth ^" m the following description, particularly when considered in conjunction with the accompanying examples and drawings.

FIGS. 1A-1B illustrate an exemplary dross removal apparatus.

[030] FlG, 2 is a flow chart illustrating an exemplary method of using the dross removal apparatus.

[031] FIG. 3A illustrates an exemplary dam placed in a fashion suitable to protect the motor area of a solder apparatus.

[032] RG, 3B illustrates collection of dross in an exemplary solder dross collection receptacle.

[033] FIG. 3G illustrates addition of a preferred additive, MS2® Molten

Solder Surfactant, to ihe solder dross collection receptacle containing collected dross.

[034] FfG. 3D illustrates manual mixing of the dross and the additive,

IV1S2® Molten Solder Surfactant,

[035] FlG, 3E illustrates additive and oxide residues removed from the receptacle.

DETAILED DESCRIPTION

The present invention now will be described more fully hereinafter. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

ATL IMANAUE-7252804 1 [037] Ail publications, patents and patent applications cited herein, whether supra or infra, are hereby incorporated by reference in their entirety,

[038] The features of the containment apparatus, related methods, uses, and the like will now be discussed in greater detail below.

[039] The present application will now be described in connection with certain embodiments, which are not intended to limit the scope of the invention. On the contrary, the present application covers all alternatives, modifications, and equivalents as included within the scope of the claims. Thus, the following will illustrate the practice of the present application, for the purposes of illustration of certain embodiments and is presented to provide what is believed to be a useful and readily understood description of its procedures and conceptual aspects.

A. Solder Dross Removal

In one embodiment, the solder dross removal apparatus (also referred to herein as a dross removal receptacle) forms a part of a solder reservoir, most preferably a removable part of the solder reservoir. By removable is meant that the dross removal apparatus is capable of movement or maneuver in the solder bath, e.g., up and down to vary its height or to a different position in the soider bath, and, if desired, the dross removal apparatus may also be removed outright from the solder bath for removal of spenl additive, or alternatively, tilted for ease of emptying.

[041] In this embodiment, the soider dross removal apparatus may be of any suitable size or configuration for placement within the solder reservoir of the soldering machine. Figs. 1A-1 B show an exemplary soider dross removal apparatus 10. Fig. 1A is a view from the top looking into the apparatus. In this embodiment, the apparatus includes a receptacle, container or cage 12 comprising four sides and a bottom panel 20. At least some of the sides may be solid while others include an apertured section 16 as will be described further below. The sides may be of different height from each other, or may be of the same height. In one embodiment, the receptacle has one (or sometimes greater than one) side that is about 1 ", 2", or 3" (about 1 " to about 3") (2.54 cm, 5.08 cm or 7.62 cm) lower than the other sides. In one embodiment, where the receptacle is an open rectangular prism, one of the long sides lengthwise is about 1 " - 3" (2.54 cm - 7.82 cm) shorter than the other three sides. In this embodiment, the lower

ATL. IMΛNAGΠ-7252804 i Q side allows dross to be moved into the receptacle while the higher sides retain the dross that has already been moved to the receptacle, along with the liquid additive, and any treated dross, In another embodiment, one or more sides (e.g., one, two, or three sides) may include an extended apertured portion above the solid wall. In this embodiment, the sides of the receptacle are solid and the same size. However, one, two or three of the sides further include an apertured portion at the top of the solid side. This extended portion may extend from about 1 " to 3" (2.54 cm to 7.82 cm) above the solid side in height. The extended apertured portion allows solder to flow out of the receptacle and back into the solder bath while retaining the dross, liquid additive, and treated dross. It will be appreciated that the container may be of any suitable shape, with any number of sides, as appropriate to use off-line or as part of the solder reservoir. In one embodiment, the container is an open rectangular prism or cuboid. The bottom, additionally to the sides or alone, may include a further apertured portion or screen area 14 to allow the solder to enter and/or circulate through the apparatus. It will be appreciated that all or a portion of the bottom may be constructed from or with an apertured or perforated material.

[042] The apertured area is dimensioned to allow a desired amount of solder to enter the apparatus and/or to allow a desired flow of solder through the apparatus. In certain embodiments, VA, 1/3, Vi, or more of the bottom area and/or side areas is apertured. In further embodiments, 80-90% of the area of the bottom panel is apertured. In even further embodiments, the bottom panel is about 10" x 4" (25.4 cm x 10,18 cm). In this embodiment, the apertured portion is about 2" x 4" (5.08 cm x 10.16 cm). The remainder of the bottom panel is solid metal or plastic.

[043] The openings of the apertured portion are of any suitable size to allow solder to flow through the apertures in the receptacle while retaining at least a portion of the dross or treated dross (sludge) or untreated dross. The openings may be uniform or not in order to provide the desired flow of solder. In one non- limiting embodiment, the apertured portion is formed from perforated sheet metal or a screen with openings of about 0.08" to 0.187" (0.2032 cm to 0.475 cm) in diameter. In one embodiment, the apertures are holes with a diameter of about 0.118" ± 0.010" (0.29972 cm ± 0.0254 cm). That is to say, in a particular embodiment, the holes have a diameter of approximately 0.10 inches.

A TL /MANAUH-7252804 1 10 [044] The apertured portion may be formed of any suitable material, including, but not limited to, metal or plastic. In one embodiment, the apertured portion(s) is at least partly formed of stainless steel or titanium. In an embodiment, the apertured portion is formed of perforated stainless steel. Where the bottom of the apparatus is partially apertured, the remainder may be formed of a solid material 18 as shown in Fig. 1A. The solid portions of the apparatus may also be formed of any suitable material, including, but not limited to metal or plastic. In one embodiment, the solid ρortion(s) is at least partly formed of stainless steel or titanium or any other material suitable for stable use in a solder bath.

[045] The receptacle may be further attached or coupled to a lift member or lever 22 for moving the receptacle within the solder reservoir. The lift member may be formed of one or several pieces. As seen in Fig. 1A ₁ where the lift member is formed of separate parts, the parts may be assembled using any suitable means including, but not limited to, welding, adhesives, and/or fasteners 24. The lift member is affixed to the receptacle such that the receptacle may be moved to and from the solder reservoir as well as lifted within the solder reservoir. In another embodiment, the lift member and at least a portion of the receptacle are unitary. As seen in Fig. 1 B. the lift member 22 may include a retention member or portion 32 for coupling the apparatus to the solder reservoir. In the embodiment shown, the retention portion 32 is proportioned to "hook" on the side of the solder reservoir such that one or more legs 34 of the retention portion 32 rests against the side of the solder reservoir (not shown). It will be appreciated where there are two arms, the arms may be of same or different lengths. In this embodiment, the retention portion includes a horizontal section that is dimensioned to fit across the edge of the solder reservoir or bath. The retention portion further includes at least one vertical section that is coupled or connected to the horizontal section. At least a portion of the vertical section rests along the outer side of the solder reservoir or bath. The vertical section may provide stability to the receptacle as it is retained at the edge of the solder reservoir or bath. The retention portion may be adjustable in height such that the receptacle may be adjusted in height in relation to the surface of the solder level. Such height adjuster may be by any suitable means known in the art including an adjustable pin or a further horizontal section that is adjustable by movement of a screw or pin as seen in Fig. 1 B. In another

ATL MANAGE- 7252804 I 1 i embodiment, the retention portion may include a height adjuster coupled to the horizontal portion by an adjuster. In one embodiment, the height adjuster is a plate or bar dimensioned to fit across the side of the solder bath or reservoir. In this embodiment, the height adjuster is coupled to the horizontal or vertical sections such that the height adjuster may be moved up or down relative to the horizontal section. In this manner, the height of the receptacle in relation to the level of solder may be adjusted as the retention portion rests on the edge of the solder bath or receptacle at the height of the height adjuster. As the height adjuster Is adjusted closer to the horizontal plate, the receptacle is lowered in relation to the level of solder, Similarly, as the height adjuster is adjusted farther away from the horizontal plate, the receptacle is raised in relation to the level of the solder. As seen in Fig. 1 B, the retention portion 32 may be constructed and/or configured such that at least a portion of the receptacle 12 remains below the solder surface when the retention portion 32 is positioned on the solder reservoir.

[046] Fig. 1 B is a side view of one embodiment of the apparatus 10. At least one of the sides of the receptacle may include a solid portion 26 and an apertured portion 28. In related embodiments, one, two, three or four sides include a solid portion and an apertured portion. The apertured portion may comprise %, 1/3, Y?., or more of the side. In one embodiment, the sides of an open cube or rectangular prism shaped receptacle are solid. As described above, three of the sides may further include an extended aperture section above the solid side wall. This embodiment allows the lower side to be at or near the solder level to facilitate moving or placing the dross into the receptacle while the apertured portion helps retain the dross and liquid additive in the receptacle.

[047] As noted above, the apparatus may include a lift member 22. The lift member may include a handle 30 to allow for manual maneuvering of the apparatus. The apparatus may be maneuvered within the solder bath (horizontally and vertically) as well as may be removed from the bath. The member may further include the retention portion or member 32 that can rest on the side or edge of the solder reservoir. In this way, the material in the receptacle may be stirred or treated without the need for removing the receptacle from the solder reservoir. The retention portion 32 may be configured such that the receptacle is completely removed from the reservoir when the retention portion is rested on the reservoir. In another embodiment the retention portion 32 may be configured such that at

ATI i.MΛNAGF-7252804 1 i i least a portion of the receptacle remains in the reservoir. In another embodiment, the receptacle may be secured above the level of the solder. It will be appreciated that the lift member and/or the retention portion may be adjustable.

B. MMbQd of _.. Treating and Removing Dross

[048] The following description is further in reference to Figs. 2 and 3A-3E.

The subject receptacle may be of any of a number of different dimensions as described in detail above. Preferably, the receptacle is sized to fit within the solder reservoir without impeding or significantly affecting operation of the reservoir. In one embodiment, the receptacle is sized such that the bottom of the receptacle sits below the surface of the solder in the solder receptacle (e.g., from about two to four inches below the solder surface) during both solder apparatus operation, and removal and treatment of dross.

[049] Fig. 2 shows an exemplary method of treating and removing dross using a solder dross removal receptacle as described above. For ease of transfer, dross that has formed on the surface of the solder bath may first be moved to an area of the solder pot in proximity to the placement of the solder dross removal receptacle. Optionally, a barrier or dam is placed within the solder apparatus (solder pot) to protect the motor area, e.g., from dross, additives and the like, preferably prior to dross collection.

[050] Dross that has formed as part of the soldering operation is placed into the solder dross removal receptacle that is removably contained within the solder apparatus, or alternatively, is off-line. As mentioned above, the size of the basket is designed to fit the size of the solder apparatus. During operation, the dross removal receptacle is generally mounted within the solder apparatus, e.g., such that the bottom of the receptacle is below the surface of the molten solder. Prior to placement of dross within the solder dross removal receptacle, the receptacle is typically lifted from its base level within the solder apparatus such that the bottom of the receptacle is above the solder surface. In yet a related embodiment, the receptacle, upon lifting, may sit upon a lift member or lever to thereby raise and lower the level of the receptacle within the solder apparatus. Alternatively, the receptacle is lifted from its base level within the solder apparatus such that the bottom of the receptacle is maintained below the solder surface. In

ATL iMΛNAϋt-725 '804 ! 13 another embodiment, the receptacle is lifted entirely above the solder level before or after treatment of the dross.

[0S1] The dross can be added to the receptacle by any fashion - i.e., automatically or manually. Most simply, dross that has formed is scooped or moved (i.e., manually removed) from the surface of the molten solder and manually placed into the dross removal receptacle. Items suitable for placing or moving dross into the dross removal receptacle include a ladle, spoon, spatula, or the like. As described above, the dross removal receptacle may form a removable part of the solder apparatus, or may be used off-line, e.g., in an adjacent solder apparatus or pot, such as a small pot sitting besides the main solder apparatus such as a wave soldering machine. The dross removal receptacle may be utilized in any soldering apparatus, such as in a wave soldering, cascade soldering, fountain soldering system, or the like. Illustrative systems are described in the ASM Handbook, Volume 8, "Welding, Brazing, and Soldering". The dross removal receptacle may form part of the solder apparatus, or may be used in any suitable offline location that provides for ease of dross removal, optional treatment with an additive for removing or assimilating dross, and preferably, containment, re-use or reclamation of solder released from the treated dross. In one aspect, the dross rβmova! receptacle provides a contained area for treating dross with a liquid additive capable of assimilating dross. This is in sharp contrast to the approach most commonly employed in the soldering industry - which is to pour or place additive directly onto the solder in the solder bath or reservoir.

[052] In yet another embodiment, a bottom portion of the receptacle

(including the bottom and lower portion of the sides) is apertured, to thereby allow solder to flow through. Such an aperture section further allows the solder that is recovered from treatment of the dross to flow back into the solder bath. In such embodiments, the apertured section will typically comprise anywhere from about the bottom only of the receptacle to the bottom half of the receptacle, including one or more of its sides.

[053] A suitable amount of additive is then added to the dross-containing receptacle, to thereby consume or assimilate the dross therein. By virtue of containment of the dross in the dross-containing receptacle, less additive is required to assimilate/treat the dross, resulting in significant cost savings to the user. Particularly preferred additives for combined use with the instant solder

ATL IMANAGE-72528C") I i i dross removal receptacle are those described in Applicant's U.S. Patent Publication No. 2005/0230457, and Internationa! Patent Publication Nos. WO 2005/110857 and WO 2006/032006, the contents each of which are expressly incorporated herein by reference in their entirety. In a preferred embodiment, the additive is a liquid additive. In an embodiment, the additive is an organic liquid active additive. In yet another embodiment, the additive is a liquid surfactant. In yet an additional embodiment, the liquid additive comprises dirner or trimer acids. See, e.g., Kirk-Othmer Encyclopedia of Chemical Technology, "Dimer Acids", John Wiiey and Sons, Inc., "Dimer Acids", in ECT, 3 ^rd ed., Voi. 7, p. 768-782, Leonard, E. C, as well as references cited therein, each of which is incorporated herein by reference, for a detailed description of dimer acids. An exemplary liquid additive is MS2® Molten Solder Surfactant.

[054] In an alternative embodiment, the additive is a liquid additive as described in Chinese Patent Publication No. CN101215712. In the foregoing embodiment, the additive comprises nonyl phenol polyoxyethylene ether, cyciohexylamine hydrobromate, diphenyi guanidine hydrobromate, phosphoric acid, and phytic acid.

[OSS] The additive is mixed or agitated with the dross by any suitable mixing means in the solder dross removal receptacle. Preferably, the additive is sufficiently effective to allow hand mixing, such as with a spoon or spatula, although any suitable manner of mixing may be employed, e.g., use of an agitator. Generally, as the additive acts upon the dross, a reaction is visible as the dross is consumed. Preferably, addition of the additive and subsequent mixing is effective to consume the dross, thereby releasing metal back into the solder bath, e.g., through the apertures, while maintaining or capturing the resultant treated dross or residues in the solder dross removal receptacle. The treated residues (i.e., spent additive and the like) are then removed from the receptacle, for instance, by placement into a containment vessel, preferably taking care to remove only treated residues and spent additive rather than solder.

[056] The foregoing steps are then repeated as necessary, ideally until the solder pot is visually observed to be mostly free or free of dross. Any residual amounts of dross may be simply removed by use of a towel, sponge, or other suitable absorbent material.

ATL IMANAGE-725280Λ 1 15 [057] In reference to Fig, 3A, in customary usage, prior to removal or release of the solder dross collection receptacle, operation of the solder machine 42 is stopped. In one embodiment, a dam or barrier 44 is placed within the solder apparatus, e.g. to protect the motor area prior to dross collection and/or removal. Dross is then removed from the solder bath and transported to the dross collection receptacle, e.g., manually, using a ladle, spoon, spatula or the like. See, e.g., Fig. 3B ₁ which shows the receptacle 40 with the dross from the molten solder surface. It will be appreciated that the dross may be removed from the surface of the molten solder and placed in the dross removal receptacle by automated means, not shown. As can be seen, dross can be placed within the receptacle to any level, although preferably, dross is added to the receptacle such that the container is nearly full. In one embodiment, the solder dross removal receptacle is lifted from its base level within the solder receptacle prior to placement of dross within the solder dross removal receptacle. The removal receptacle is preferably lifted to a level where the bottom of the receptacle remains below the solder surface. The removal receptacle may be manually maintained in the lifted position or the solder dross removal receptacle may include a lift member adapted to retain the removal receptacle in a lifted position as described above.

[058] A suitable quantity of additive such as IV1S2® Molten Solder

Surfactant or any other suitable additive is added to the receptacle, such that dross is consumed and assimilated into the additive layer. Preferred additives are described in U.S. Patent Publication No. 2005/0230457 and PCT Publication Nos. WO 2005/110657 and WO 2006/032006.

[059] In one example, approximately 200 mL of MS2® is added to a receptacle having dimensions of approximately 4 inches by 8 inches (10.18 cm by 20.32 cm). As a general rule of thumb, approximately one liter of MS2® is effective to treat approximately one hundred pounds of dross. Fig. 3C shows additive 46 being added to the dross removal receptacle 40 after dross 47 has been added from the molten solder surface 45. As shown in Fig. 3D, the resulting mixture is then mixed, e.g., manually or automatically. Shown is mixing with a spoon 48, Preferably a suitable amount of additive is added to consume or assimilate at least a portion of the dross. Preferably, 75-100% of the dross is consumed with addition of the additive and mixing. In embodiments, 75%, 80%, 90%, or 95% of the dross is consumed, As illustrated, released/recovered solder

ATL IMANAGE-7252804 ! 16 can then flow back into the solder bath through the apertures in the receptacle 40. As illustrated in Fig. 3E, the receptacle 40 can then be removed in its entirety from the solder apparatus, to thereby remove any additive and/or spent additive and oxide residues 50, while preferably taking care to ensure that no solder is thereby removed.

[060] The steps are repeated until the solder pot is free or substantially free of dross. Typically, such assessment is made by visual inspection. The receptacle is then readily cleaned, e.g., using a towel, rag, or any similar sort of item, and the receptacle placed pack into the solder apparatus. Additional solder is added to the solder pot as needed, and operation of the soldering apparatus continued.

[061] Al! articles, books, patents, patent publications and other publications referenced herein are incorporated by reference in their entireties. However, where a patent, patent application, or publication containing express definitions is incorporated by reference, those express definitions should be understood to apply to the incorporated patent, patent application, or publication in which they are found, and not necessarily to the text of this application, in particular the claims of this application.

[062] It is to be understood that while the invention has been described in conjunction with certain preferred and specific embodiments, the foregoing description as well as the example that follows is intended to illustrate and not limit the scope of the accompanying claims. Other aspects, advantages and modifications will be apparent to those skilled in the art to which this application pertains.

[063] The following consumption savings data were calculated based upon collection of the following comparative data. Particular amounts of additive and solder bar added to the solder apparatus during operation are provided in Table 1 below. The additive used was MS2®. The dross removal apparatus employed is pictured in Fig. 3A-3E.

ATL [MANAGE-7252804.1 17 Table 1. Operation of solder apparatus over course of 1 week absent solder dross removal apparatus

Table 2. Operation of solder apparatus over course of 1 week using solder dross removal apparatus

[084] Based upon the results in Tables 1 and 2, a consumption savings of additive of at least 40% was observed The solder dross removal apparatus is surprisingly simple in both its design and adaptability for use in a variety of soldering machines Use of the dross removal apparatus, in particular when coupled wsth use of a liquid additive such as MS2© or the like, is effective to (i) reduce liquid additive consumption, e g , due to placement of the additive in a

AH !MAN 4.GL ^" "252&04 : 18 smaller confined area of the solder bath, in contrast to prior methods in which a layer of additive is maintained on top at least a significant portion of a bath of molten solder, (is) provide significant cost savings due to the need for reduced quantities of additive, as we!! as less operational down time required for cleaning of the solder bath, among other advantageous features.

[085] It will be appreciated by those skilled in the art that changes could be made to the embodiments described above without departing from the broad inventive concept thereof. It is understood, therefore that this invention is not limited to the particular embodiments disclosed, but it is intended to cover modifications that are within the spirit and scope of the invention, as defined by the appended claims. Any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.

ATI ΪMANAGF-7^2804 f 19