Title:
TOOL FOR ULTRASONIC BONDING AND DEVICE FOR ULTRASONIC BONDING
Document Type and Number:
WIPO Patent Application WO/2018/025362
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a tool for ultrasonic bonding having a structure capable of keeping favorable bondability for a material to be bonded after ultrasonic vibration processing. A bonding tool (4), which is a tool for ultrasonic bonding according to the present invention, has a plurality of protrusions (80) in a protrusion region (8) at an abutment tip end portion (4t). The plurality of protrusions (80) are formed at equal longitudinal intervals (DX) in the X-direction, which is the longitudinal direction of the protrusion region (8), and an X-direction outermost protrusion (80xe) in the outermost position in the X-direction is arranged a longitudinal end side distance (EX) apart from the end side of the protrusion region (8) in the X direction. The plurality of protrusions (80) are arranged to satisfy a first arrangement condition {0.349 ≤ EX/DX ≤ 0.510}.
Inventors:
ICHINOSE AKIHIRO (JP)
YAMADA YOSHIHITO (JP)
YAMADA YOSHIHITO (JP)
Application Number:
PCT/JP2016/072886
Publication Date:
February 08, 2018
Filing Date:
August 04, 2016
Export Citation:
Assignee:
TOSHIBA MITSUBISHI ELEC IND (JP)
International Classes:
B23K20/10
Foreign References:
| JP2016052670A | 2016-04-14 | |||
| JP2013255927A | 2013-12-26 | |||
| US20160043360A1 | 2016-02-11 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF:
Previous Patent: ANALYSIS DATA PROCESSING METHOD AND ANALYSIS DATA PROCESSING DEVICE
Next Patent: REFRIGERATING DEVICE
Next Patent: REFRIGERATING DEVICE