Title:
TOOL WITH SINTERED BODY POLISHING SURFACE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/023949
Kind Code:
A1
Abstract:
An efficiently processible polishing tool, particularly used for a CMP pad conditioner,
capable solving problems in a fixing strength for fixing abrasive grains to a
base plate and problems in nonuniform polished surface and a method of effectively
manufacturing the polishing tool. The polishing tool (1) comprises a polishing
part formed of a super abrasive grain sintered body sintered integrally with
the lining material of a cemented carbide. The polishing part comprises a plurality
of polishing units (2) with top parts. The top parts are positioned on an approximately
same plane. The polishing units (2) are formed by forming a linear groove (3) group
in the polishing part.
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Inventors:
ISHIZUKA HIROSHI (JP)
Application Number:
PCT/JP2006/316737
Publication Date:
March 01, 2007
Filing Date:
August 25, 2006
Export Citation:
Assignee:
ISHIZUKA HIROSHI (JP)
International Classes:
B24D3/00; B24B53/017; B24B53/12
Foreign References:
JPH1071559A | 1998-03-17 | |||
JPH08243927A | 1996-09-24 | |||
JP2001347454A | 2001-12-18 | |||
JP2003511255A | 2003-03-25 | |||
JPS58199776A | 1983-11-21 |
Other References:
See also references of EP 1944125A4
Attorney, Agent or Firm:
KUZUWA, Kiyoshi (KUZUWA & PARTNERS T & T Bldg., 8-21, Tomihisa-ch, Shinjuku-ku Tokyo 67, JP)
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