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Patent Searching and Data


Title:
TOPOLOGICAL INSULATION DEVICE HAVING NEGATIVE THERMAL EXPANSION
Document Type and Number:
WIPO Patent Application WO/2023/137615
Kind Code:
A1
Abstract:
The present invention belongs to the field of thermal functional devices. Provided is a topological insulation device having negative thermal expansion. In the topological insulation device, three assemblies of different properties are constructed using assembly units of special geometric structures, and then different assemblies are assembled to form an outer heat-conduction ring and a thermal insulation region, which is wrapped by the outer heat-conduction ring, so that the device has the characteristics of surface thermal conduction and internal thermal insulation, and an edge state and a topological protection property, which are similar to those of an electrical topological insulator, are realized in a macroscopic heat conduction process.

Inventors:
LI YING (CN)
WANG DONG (CN)
JIANG CHAORAN (CN)
SHEN XIANGYING (CN)
HUANG JIPING (CN)
Application Number:
PCT/CN2022/072679
Publication Date:
July 27, 2023
Filing Date:
January 19, 2022
Export Citation:
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Assignee:
UNIV ZHEJIANG (CN)
International Classes:
H01B17/60
Foreign References:
CN113738764A2021-12-03
CN112185708A2021-01-05
CN107946452A2018-04-20
CN112560202A2021-03-26
US20130246018A12013-09-19
AU2003236586A12004-01-23
US20210020263A12021-01-21
US20160136877A12016-05-19
CN113345536A2021-09-03
Attorney, Agent or Firm:
HANGZHOU QIUSHI PATENT OFFICE CO., LTD. (CN)
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