Title:
TOWARDS ELECTRICAL, INTEGRATED IMPLEMENTATIONS OF SIMPL SYSTEMS
Document Type and Number:
WIPO Patent Application WO/2010/105993
Kind Code:
A3
Abstract:
The invention is to provide novel, strong, cost-effective and efficiently deployable technological means that are sufficiently robust to provide high assurance for authenticity and trustworthiness of hardware components (Integrated Circuits (ICs)) manufactured in untrustworthy foundries while providing sensitive testing information and only to authorized parties allow for monitoring and auditing hardware after delivery by the manufacturer exploit physical properties at the (deep-) submicron and nano-scale of the underlying hardware not only to achieve unique device identification but also to detect small tempering and the presence of Trojans. The invention aim is to increase the protection of hardware systems against counterfeiting, cloning, tampering, reverse engineering and insertion of malicious components.
Inventors:
RUEHRMAIR ULRICH (DE)
STUTZMANN MARTIN (DE)
CSABA GYOERGY (DE)
LUGLI PAOLO (DE)
FINLEY JONATHAN (DE)
JIRAUSCHEK CHRISTIAN (DE)
JAEGER CHRISTIAN (DE)
STUTZMANN MARTIN (DE)
CSABA GYOERGY (DE)
LUGLI PAOLO (DE)
FINLEY JONATHAN (DE)
JIRAUSCHEK CHRISTIAN (DE)
JAEGER CHRISTIAN (DE)
Application Number:
PCT/EP2010/053229
Publication Date:
December 08, 2011
Filing Date:
March 12, 2010
Export Citation:
Assignee:
UNIV MUENCHEN TECH (DE)
RUEHRMAIR ULRICH (DE)
STUTZMANN MARTIN (DE)
CSABA GYOERGY (DE)
LUGLI PAOLO (DE)
FINLEY JONATHAN (DE)
JIRAUSCHEK CHRISTIAN (DE)
JAEGER CHRISTIAN (DE)
RUEHRMAIR ULRICH (DE)
STUTZMANN MARTIN (DE)
CSABA GYOERGY (DE)
LUGLI PAOLO (DE)
FINLEY JONATHAN (DE)
JIRAUSCHEK CHRISTIAN (DE)
JAEGER CHRISTIAN (DE)
International Classes:
H04L9/32; G06N3/063; G11C7/10; H01L27/10; H01Q15/00; H01Q17/00
Domestic Patent References:
| WO2009024913A2 | 2009-02-26 |
Other References:
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YING SU ET AL: "A Digital 1.6 pJ/bit Chip Identification Circuit Using Process Variations", IEEE JOURNAL OF SOLID-STATE CIRCUITS, IEEE SERVICE CENTER, PISCATAWAY, NJ, USA, vol. 43, no. 1, 1 January 2008 (2008-01-01), pages 69 - 77, XP007918256, ISSN: 0018-9200
DEEPU ROY ET AL: "Comb Capacitor Structures for On-Chip Physical Uncloneable Function", IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 22, no. 1, 1 February 2009 (2009-02-01), pages 96 - 102, XP011243327, ISSN: 0894-6507, DOI: DOI:10.1109/TSM.2008.2010738
KATSIA E ET AL: "Integration of organic based Schottky junctions into crossbar arrays by standard UV lithography", ORGANIC ELECTRONICS, ELSEVIER, AMSTERDAM, NL, vol. 9, no. 6, 1 December 2008 (2008-12-01), pages 1044 - 1050, XP025546160, ISSN: 1566-1199, [retrieved on 20080830], DOI: DOI:10.1016/J.ORGEL.2008.08.010
GODLEWSKI M ET AL: "Vertically stacked non-volatile memory devices - material considerations", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 85, no. 12, 1 December 2008 (2008-12-01), pages 2434 - 2438, XP025710409, ISSN: 0167-9317, [retrieved on 20080921], DOI: DOI:10.1016/J.MEE.2008.09.012
KATSIA E ET AL: "Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 94, no. 14, 6 April 2009 (2009-04-06), pages 143501 - 143501, XP012120797, ISSN: 0003-6951, DOI: DOI:10.1063/1.3114442
ROBYN COLOPY: "SRAM Characteristics as Physical Unclonable Functions", MAJOR QUALIFYING PROJECT REPORT,, no. MQP-BS2-0803, 6 March 2009 (2009-03-06), pages 1 - 64, XP007918253, Retrieved from the Internet [retrieved on 20110413]
STAN M R ET AL: "CMOS/nano Co-design for crossbar-based molecular electronic systems", IEEE TRANSACTIONS ON NANOTECHNOLOGY, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 2, no. 4, 1 December 2003 (2003-12-01), pages 217 - 230, XP011106886, ISSN: 1536-125X, DOI: DOI:10.1109/TNANO.2003.820804
GUAJARDO J ET AL: "Brand and IP protection with physical unclonable functions", CIRCUITS AND SYSTEMS, 2008. ISCAS 2008. IEEE INTERNATIONAL SYMPOSIUM ON, IEEE, PISCATAWAY, NJ, USA, 18 May 2008 (2008-05-18), pages 3186 - 3189, XP031392690, ISBN: 978-1-4244-1683-7
YING SU ET AL: "A Digital 1.6 pJ/bit Chip Identification Circuit Using Process Variations", IEEE JOURNAL OF SOLID-STATE CIRCUITS, IEEE SERVICE CENTER, PISCATAWAY, NJ, USA, vol. 43, no. 1, 1 January 2008 (2008-01-01), pages 69 - 77, XP007918256, ISSN: 0018-9200
DEEPU ROY ET AL: "Comb Capacitor Structures for On-Chip Physical Uncloneable Function", IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 22, no. 1, 1 February 2009 (2009-02-01), pages 96 - 102, XP011243327, ISSN: 0894-6507, DOI: DOI:10.1109/TSM.2008.2010738
KATSIA E ET AL: "Integration of organic based Schottky junctions into crossbar arrays by standard UV lithography", ORGANIC ELECTRONICS, ELSEVIER, AMSTERDAM, NL, vol. 9, no. 6, 1 December 2008 (2008-12-01), pages 1044 - 1050, XP025546160, ISSN: 1566-1199, [retrieved on 20080830], DOI: DOI:10.1016/J.ORGEL.2008.08.010
GODLEWSKI M ET AL: "Vertically stacked non-volatile memory devices - material considerations", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 85, no. 12, 1 December 2008 (2008-12-01), pages 2434 - 2438, XP025710409, ISSN: 0167-9317, [retrieved on 20080921], DOI: DOI:10.1016/J.MEE.2008.09.012
KATSIA E ET AL: "Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 94, no. 14, 6 April 2009 (2009-04-06), pages 143501 - 143501, XP012120797, ISSN: 0003-6951, DOI: DOI:10.1063/1.3114442
ROBYN COLOPY: "SRAM Characteristics as Physical Unclonable Functions", MAJOR QUALIFYING PROJECT REPORT,, no. MQP-BS2-0803, 6 March 2009 (2009-03-06), pages 1 - 64, XP007918253, Retrieved from the Internet
Attorney, Agent or Firm:
HERRMANN, Franz (München, DE)
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