TRACEABILITY OF SUBSEQUENT LAYER STRUCTURE MANUFACTURING OF MAIN BODY FOR COMPONENT CARRIERS BY MEANS OF LATERALLY AND VERTICALLY DISPLACED INFORMATION CARRYING STRUCTURES

Title:

TRACEABILITY OF SUBSEQUENT LAYER STRUCTURE MANUFACTURING OF MAIN BODY FOR COMPONENT CARRIERS BY MEANS OF LATERALLY AND VERTICALLY DISPLACED INFORMATION CARRYING STRUCTURES

Document Type and Number:

WIPO Patent Application WO/2019/185000

Kind Code:

A1

Abstract:

A main body for component carriers (100), comprising: a stack (102) comprising a plurality of conductive layer structures and/or electrically insulating layer structures (110-112); and at least two information carrying structures (107-109), the at least two information carrying structures being arranged to be vertically displaced on at least two different layer structures among the layer structures (110-112), wherein at least two of the at least two information carrying structures (107-109) are laterally displaced on the stack (102) in a planar graph.

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Inventors:

TAY SEOK KIM (SG)
IBRAHIM AZMI (MY)
DAI WENPING (SG)
SHEN CHUNJIE (CN)

Application Number:

PCT/CN2019/080262

Publication Date:

October 03, 2019

Filing Date:

March 28, 2019

Export Citation:

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Assignee:

AT & S CHINA CO LTD (CN)

International Classes:

G06K7/14

Foreign References:

CN102271464A	2011-12-07
CN201522810U	2010-07-07
CN101471328A	2009-07-01
GB2196184A	1988-04-20

Other References: