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Title:
TRANSCEIVER MODULE, RECEPTACLE ASSEMBLY FOR TRANSCEIVER MODULE, AND TRANSCEIVER MODULE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2017/195714
Kind Code:
A1
Abstract:
An electrode unit of a module substrate 16 arranged inside a transceiver module 14 is formed by contact pad groups that are formed arrayed approximately parallel to the long side of the module substrate 16. The contact pad groups are configured to include a row of ground line pads 16EGi (i = 1 to 14) formed at prescribed intervals from one end to the other end, and two rows of signal line pads 16EAi, 16EBi (i = 1 to 36) formed between ground line pads 16EGi.

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Inventors:
ITO TOSHIYASU (JP)
TAKAI YOSUKE (JP)
Application Number:
PCT/JP2017/017335
Publication Date:
November 16, 2017
Filing Date:
May 08, 2017
Export Citation:
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Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
H05K1/11
Foreign References:
US20070232091A12007-10-04
US20020093796A12002-07-18
JP2004533008A2004-10-28
US6674644B22004-01-06
EP2157839A12010-02-24
US6731510B12004-05-04
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