Title:
TRANSFER APPARATUS AND METHOD FOR TRANSFERRING LIGHT-EMITTING DIODE CHIP
Document Type and Number:
WIPO Patent Application WO/2019/177337
Kind Code:
A1
Abstract:
A transfer apparatus for transferring a light-emitting diode chip comprises: a stage on which a first substrate is placed on one side thereof, the first substrate having a plurality of light-emitting diode chips mounted thereon; a work table on which a second substrate onto which the plurality of light-emitting diode chips are to be transferred is seated; and a push pin module for pushing the other side of the first substrate and transferring the plurality of light-emitting diode chips to the second substrate in a state in which one side of the first substrate and the second substrate are disposed to face each other. The push pin module includes a plurality of push pin units each having a push pin for pushing the other side of the first substrate. The push pin module transfers, to the second substrate, the plurality of light-emitting diode chips corresponding to respective push pins of the plurality of push pin units at a time.
Inventors:
RYU BENG SO (KR)
Application Number:
PCT/KR2019/002842
Publication Date:
September 19, 2019
Filing Date:
March 12, 2019
Export Citation:
Assignee:
QMC INC (KR)
International Classes:
H01L21/67; H01L21/677; H01L21/68; H01L33/00
Foreign References:
| KR20170138593A | 2017-12-18 | |||
| JP2005107930A | 2005-04-21 | |||
| KR100824083B1 | 2008-04-21 | |||
| KR100206911B1 | 1999-07-01 | |||
| KR20150027718A | 2015-03-12 | |||
| JP2003028974A | 2003-01-29 | |||
| JP2004030443A | 2004-01-29 |
Attorney, Agent or Firm:
YOO, Jong Woo (KR)
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