Title:
TRANSFER DEVICE AND METHOD FOR TRANSFERRING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2020/184859
Kind Code:
A1
Abstract:
A transfer device for transferring a semiconductor chip comprises: a stage having one surface on which a first substrate having a semiconductor chip mounted thereon is placed; a work table on which a second substrate to which the semiconductor chip is to be transferred is placed; and a pressing pin module, which pushes a part corresponding to the semiconductor chip on the other surface of the first substrate while one surface of the first substrate and the second substrate are arranged to face each other, thereby transferring the semiconductor chip to the second substrate. The pressing pin module comprises: a pressing pin unit including a pressing pin for pushing the other surface of the first substrate; and a load adjusting unit for adjusting a load applied to the pressing pin when the semiconductor chip is transferred to the second substrate.
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Inventors:
RYU BENG SO (KR)
KIM JEONG SIK (KR)
PARK JONG IN (KR)
KIM JEONG SIK (KR)
PARK JONG IN (KR)
Application Number:
PCT/KR2020/002375
Publication Date:
September 17, 2020
Filing Date:
February 19, 2020
Export Citation:
Assignee:
QMC INC (KR)
International Classes:
H01L21/67; H01L21/52; H01L21/677; H01L33/00
Foreign References:
| KR20170138593A | 2017-12-18 | |||
| KR100206911B1 | 1999-07-01 | |||
| KR20180115584A | 2018-10-23 | |||
| KR20010094965A | 2001-11-03 | |||
| KR100824083B1 | 2008-04-21 |
Attorney, Agent or Firm:
YOO, Jong Woo (KR)
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