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Title:
TRANSFER DEVICE AND TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2007/040032
Kind Code:
A1
Abstract:
A transfer device (10) comprising a first support (11) for supporting chips (C) segmented by dicing a semiconductor wafer, and a second support (12) including a sheet (S) to which the chip (C) is to be transferred. The transfer device (10) is further provided with an expander (44) for radially expanding a dicing tape (DT), a camera (37) for detecting a gap between the chips (C) formed by expansion, and a section (17) for transferring each chip (C) to the sheet (S) on condition that the gap reached a set dimension.

Inventors:
OTSUKA MASAHISA (JP)
Application Number:
PCT/JP2006/318379
Publication Date:
April 12, 2007
Filing Date:
September 15, 2006
Export Citation:
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Assignee:
LINTEC CORP (JP)
OTSUKA MASAHISA (JP)
International Classes:
H01L21/301
Domestic Patent References:
WO2004105109A12004-12-02
Foreign References:
JP3064979B22000-07-12
JP2001110757A2001-04-20
JPS62222642A1987-09-30
JPS54161882A1979-12-21
JP2001118860A2001-04-27
JP2005251986A2005-09-15
JPH0729855A1995-01-31
JP2003243332A2003-08-29
Attorney, Agent or Firm:
YAMAGUCHI, Yoshio (Izumi Building 4-17, Tsurumaki 1-chom, Tama-shi Tokyo 34, JP)
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