Title:
TRANSFER DEVICE AND TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2023/190395
Kind Code:
A1
Abstract:
Provided are a transfer device and a transfer method capable of reliably detaching an element from a transfer substrate and transferring the element to a transfer destination substrate. Specifically, a transfer substrate 22 is provided with a blistering layer 24 on which a blister 30 is generated through irradiation with an active energy ray. An element 21 is held on the blistering layer 24. A transfer destination substrate 23 is provided with a catch layer 25 on which the element 21 can be held. The catch layer 25 is disposed so as to face the transfer substrate 22. An energy irradiation unit 12, by generating the blister 30 in an element holding region 24a which is a region for holding one element 21 on the blistering layer 24, changes the inclination of the element 21 with respect to the transfer substrate 22 to bring the element 21 near the transfer destination substrate 23, and causes a portion of the element 21 to firstly make contact with the catch layer 25 in a state where the element 21 is held on the blistering layer 24.
Inventors:
KAZAMA KOICHI (JP)
OKADA TATSUYA (JP)
ZINDA TOSHIYUKI (JP)
ARAI YOSHIYUKI (JP)
OKADA TATSUYA (JP)
ZINDA TOSHIYUKI (JP)
ARAI YOSHIYUKI (JP)
Application Number:
PCT/JP2023/012307
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L21/52; H01L21/50
Domestic Patent References:
| WO2022002733A1 | 2022-01-06 |
Foreign References:
| US20170200711A1 | 2017-07-13 | |||
| JP2022115803A | 2022-08-09 |
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