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Patent Searching and Data


Title:
TRANSFER FILM, RESIN PATTERN FORMING METHOD USING TRANSFER FILM, AND CURED FILM PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/164016
Kind Code:
A1
Abstract:
The present invention provides: a photosensitive resin composition that is suitable for protection of a conductor part such as an electrode and that allows a transfer film to have satisfactory tack property, developability at low temperature, lamination property at low temperature, moisture permeability when in the form of a cured film, and adhesion to a conductor base material; a transfer film; and a production method therefor. The transfer film for forming a protective film for a conductor part comprises a support film and a photosensitive resin composition layer. The photosensitive resin composition layer includes (A) an alkali-soluble resin (excluding acid-modified epoxy (meth)acrylate compounds), (B) a compound containing a carboxyl group and an ethylenically unsaturated group, (C) a photopolymerizable compound, and (D) a photopolymerizable initiator. The alkali-soluble resin (A) has a weight-average molecular weight of 11,000-29,000 and an acid value not less than 100 mgKOH/g. The compound (B) has a weight-average molecular weight of 1,000-9,500, an acid value not less than 60 mgKOH/g, and a refractive index not less than 1.570. The ratio of the mass of the resin (A) to the mass of the compound (B) is 0.18-6.0.

Inventors:
SHIMODA, Koichiro (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
SHIBUI, Satoshi (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
NAKADE, Makoto (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
MIZUMURA, Kanako (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
YOSHIDA, Mayuki (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
Application Number:
JP2019/007370
Publication Date:
August 29, 2019
Filing Date:
February 26, 2019
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
International Classes:
G03F7/004; C08F2/50; C08F290/06; C08F299/02; G03F7/027; G06F3/041; H05K3/28
Domestic Patent References:
WO2017159543A12017-09-21
WO2016199868A12016-12-15
Foreign References:
JP2011075923A2011-04-14
JP2013232011A2013-11-14
JP2014153623A2014-08-25
JP2015064612A2015-04-09
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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