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Patent Searching and Data


Title:
TRANSFER FILM FOR THREE-DIMENSIONAL MOLDING, MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/062486
Kind Code:
A1
Abstract:
Provided is a three-dimensional molding film which has excellent moldability and is able to impart superior scratch resistance and chemical resistance to a resin molded article. Said transfer film for three-dimensional molding has, on a transfer substrate, at least one surface protection layer, and said protection layer is formed by a cured product of inonizing radiation curable resin composition containing a polycarbonate (meth)acrylate and an acrylic resin.

Inventors:
YOKOYAMA DAISUKE (JP)
NODA AKIHISA (JP)
NAKATSUGAWA YUJI (JP)
HASHIMOTO SHUNICHI (JP)
SUSUKIDA MAKOTO (JP)
Application Number:
PCT/JP2017/035482
Publication Date:
April 05, 2018
Filing Date:
September 29, 2017
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/30; B29C45/14
Foreign References:
JP2015193248A2015-11-05
JP2014195999A2014-10-16
JP2014069520A2014-04-21
JP2012056236A2012-03-22
JP2013111929A2013-06-10
JPS641726A1989-01-06
JPH03181517A1991-08-07
Other References:
See also references of EP 3521022A4
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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