TRANSFER LAMINATE AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2023/238592

A1

Provided are: a laminate which has excellent adhesiveness between a support and a metal layer (metal-plated layer) and with which a seed layer serving as a base of plating can be simply and inexpensively formed, without roughening a support surface, by means of a quality stabilizing method such as preventing scratches due to contact with an application device or contact with a transporting roll when applied to a plating base layer; and a rigid printed wiring board, a flexible printed wiring board, and a molded article which use the same.　A plating base layer containing a dispersant and a conductive substance was formed on a temporary support, a resin layer was formed thereon, and functional groups of the plating base layer and the resin layer were then reacted to produce a transfer laminate. Moreover, it has been found that the transfer laminate is bonded to both front and rear surfaces of a support or only one surface thereof, and only the temporary support of the transfer laminate is peeled off to simply and inexpensively form the plating base layer with high quality on the surface of the support, thereby completing the present invention.

FUJIKAWA WATARU (JP)
FUKAZAWA NORIMASA (JP)
HAGIWARA HIROYUKI (JP)
TAMURA REI (JP)

PCT/JP2023/017673

December 14, 2023

May 11, 2023

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DAINIPPON INK & CHEMICALS (JP)

H05K3/20; B32B15/08; H05K1/03; H05K1/11; H05K3/18; H05K3/40; H05K3/42

WO2015037512A1	2015-03-19
WO2013146195A1	2013-10-03
WO2020003877A1	2020-01-02

JP2012227301A	2012-11-15
JP2021102806A	2021-07-15
JP2010028107A	2010-02-04

ONO Takayuki (JP)

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